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Semiconductor Back End of Line Processes, Process and Thin Films Characterization, Film Stresses and Reliability. PVD, ALD, CVD, HiPIMS
Back-End-of Line (BEOL) Integration in SRAM, Spin-Torque, Resistive Random Access Memory. PVD, CVD and ALD thin film deposition. Film micro-structure and properties. Stress-related problems in BEOL. DC, RF and HiPIMS sputter deposition. Arc evaporation. Plasma-Surface interactions. 13 years academic experience…