Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

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Expert Details

Thermosetting Polymers, Product Development Process, New Business Development

ID: 728333 California, USA

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Expert is a nationally recognized authority in thermosetting polymers. He has developed a fundamental understanding of thermosetting polymers including detailed experience in the rheology of curing systems (chemorheology), cure kinetics, physical property measurements, dielectric measurements of curing, and process development. He developed several novel methods to measure the change in rheological properties during thermoset curing, including a new method to simultaneously measure the rheological and dielectric properties during during. Expert is an expert in thermal analysis (DSC, TGA, TMA) and dynamic mechanical analysis of polymers and composites. He has developed formulated products with epoxy, cyanate ester, acrylate, methacrylate, polyimides, unsaturated polyesters, siloxanes, and other curing resins. Expert has also developed products using DICY, amines, imidazoles, and anhydrides as curing agents.

Expert has published 60 technical papers (including 4 book chapters) in the field of polymeric materials for advanced electronic packaging applications, thermosettting polymers, chemorheology, and curing kinetics. He holds 13 issued US patents, and has 8 patents pending in the area of thermosetting polymers and electronic applications.

Expert was an Adjunct Professor at Syracuse University in the Dept. of Chemical Engineering and Materials Science from 1986-1993. He research areas focused on the fundamentals of thermosetting curing and chemorheology.

Expert has over twenty-eight years experience in polymers for electronic applications and composites having held scientific and leadership positions at IBM, AlliedSignal, Honeywell International, and Ablestik Laboratories. Expert conducted scientific research in chemorheology of thermosetting polymers, advanced polymer characterization, and process development for advanced electronic packaging applications. Solved major reliability problem by co-inventing a new class of toughened cyanate resins. Nine patents issued covering composition of matter and applications. Was the co-developer of a new preprege and laminate used in high-end multilayer circuit boards. Optimized the formulation, performed extensive polymer characterization and worked with the manufacturing team on the commercializaton scale-up. Expert in using thermosetting resins and various types of reinforcements (woven glass cloth, non-woven Kevlar fibers) to engineer state-of-the-art laminates for high-end printed circuit boards. Expert applied Design for Six Sigma tools to develop an enhanced buried capacitance laminate and commercialized with mulit-million annual sales. He also led the development of new laminates for semiconductor packaging substrates (laminates and bond-ply used to form high density multilayer structures).

At Honeywell electronic materials, Expert was responsible for product development engineering, materials technology, technical marketing and pilot line operations support. He led a team of 20 scientists, engineers and technicians for development of a high-density multilayer ball grid array (MLBGA) laminate substrate. Expert reorganized development team for maximum impact, improving manufacturing yields from 30% to 90%, electrical test yield gain from 10% to 70%, enabled 90% pass rate on key reliability testing. Expert focused the R&D team on new laminate solution for high-end router/switch application, completed first articles in less than two months, at 75% yields. He directed development of state-of-the-art laminate and prepregs, enabling fabrication of a high-end multilayer ball grid array (MLBGA) flip chip substrate.

Expert led the technology function (Research, Development, and Applications Engineering) for a multimillion dollar global leader in adhesives used in semiconductor packaging. Experience with die attach, capillary underfill, no-flow underfills, coatings, and encapsulants. Led the development of multiple types of electrically conductive adhesives. He led the development of thermally conductive adhesives that were electrically insulating. He is an expert in materials for semiconductor packaging. Spearheaded the implementation of statistical design tools to improve formulation efficiency and optimize formulation final properties. Expert established key ties between corporate research (globally dispersed) and development improving the new technology delivery to the formulation scientists, resulting in highly differentiated products. He developed a product science platform approach that enabled formulation scientists to develop product architectures (technology frameworks for new products) that enabled rapid product modifications.

Expert is an accomplished technology professional with demonstrated success directing new product development, leading to multi-million dollar revenues with improved profitability. He has global experience developing new products having established a full function R&D and Applications Engineering lab in Shanghai, China with three new products commercialized in the first year. Expert led the global commercialization of more than 30 new products over a two year span (2007-2008) resulting in multimillion dollar first year revenues. He top-graded the R&D and Engineering groups in multiple organizations resulting in 25% of sales from products less than 3 years old and up to $80 million in new revenues. He developed and implemented a comprehensive intellectual property process leading to 65% of products covered by at least one patent. Expert provided Design for Six Sigma training for all scientists, chemists, and applications engineers and led the Six Sigma implementation at a global electronic adhesives company resulting in two-year savings of $1.2 million and 50% reduction in customer complaints for both new and existing products. He established buy-in across key business functions, led a multifunctional team to develop and implement a customized Stage/Gate process resulting in 25% of sales from products less than three years old.

Expert has extensive experience assessing the innovation capability of technology driven organizations, developing a technology roadmap, and implementing the appropriate tools to lead the organization to higher levels of productivity and improve new product development efficiency. His has significant experience optimizing the new product development portfolio using a variety of tools.

Expert has effectively managed the intellectual property portfolio and process in multiple organizations. He has led the development of comprehensive intellectual property management process enabling the identification of potentially valuable IP thru to patent filing and ongoing patent portfolio maintenance.

He improved technology delivery by focusing applied research on developing customer-targeted product science platforms, enhancing the formulation toolbox, enabling the development of new, differentiated products. He teaches courses on Innovation and Product Development in the MBA program at Concordia University in Irvine, CA.


Year Degree Subject Institution
Year: 1983 Degree: PhD Subject: Materials Science/Polymer Science Institution: Northwestern University
Year: 1977 Degree: BS Subject: Mechanical Engineerign/Materials Science Institution: Marquette University

Work History

Years Employer Title Department
Years: 2008 to Present Employer: Undisclosed Title: President and Founder Department:
President and Founder of a management and technical consulting company. Provide consulting services in three areas; polymer technical consulting, polymer new product development, and new business development.
Years Employer Title Department
Years: 2002 to 2008 Employer: Ablestik Laboratories Title: Vice President of Technology Department:
Responsible for all research, product development and applications engineering on a global basis. Led all aspects of the commercialization process, led the Six Sigma process improvement (including Design for Six Sigma), and established a best-in-class stage/gate product development process.
Years Employer Title Department
Years: 2001 to 2002 Employer: Gotro Group Title: President Department:
Management and technology consulting group. Responsible for all aspects of running the business, providing consulting services
Years Employer Title Department
Years: 1999 to 2000 Employer: Honeywell Electronic Materials Title: Director of Technology Department:
Responsible for product development engineering, materials technology, technical marketing and pilot line operations support. Reported to VP/GM. Led a team of 20 scientists, engineers and technicians for development of a high-density multilayer ball grid array (MLBGA) substrate. Led technology integration team for the AlliedSignal acquisition of Johnson Matthey Electronics. Developed intellectual property strategy
Years Employer Title Department
Years: 1995 to 1999 Employer: AlliedSignal Electronic Materials Title: R&D Manager Department:
Led research, development and commercialization of new products for a $400 million business unit. Managed 12 direct reports consisting of Ph.D. scientists, product development engineers and lab technicians. Monitored and maintained annual operating budget of $2 million. Active participation in the Strategic Planning process, Annual Operating Plan, and Management Resource Review (employee appraisal and career development) process.
Years Employer Title Department
Years: 1994 to 1995 Employer: Aeroquip Corporate Technology Lab Title: Consulting Scientist Department:
Conducted research and product development for a provider of high technology fluid control equipment, acquiring skills stage/gate new product development processes and new business development. Developed prototypes, optimized design, and scaled-up manufacturing for a pharmaceutical high-purity transfer device and reduced the development time by two-thirds utilizing designed experiments (DOE's).
Years Employer Title Department
Years: 1982 to 1993 Employer: IBM Title: Advisory Scientist Department:
Conducted scientific research in chemorheology of thermosetting polymers, advanced polymer characterization, and process development for advanced packaging applications.

Career Accomplishments

Associations / Societies
Expert is a member of the Society of Plastics Engineers (SPE), American Chemical Society (ACS), Product Development and Management Association (PDMA), the Institute for Management Consultants (IMC), the Forensic Expert Witness Association (FEWA), the International Microelectronics and Packaging Society (IMAPS), and Medical Electronics Packaging and Technology Association (MEPTEC).
Licenses / Certifications
Expert is a Certified Management Consultant (CMC) by the Institure of Management Consultants - USA
Expert is a certified Black Belt in Design for Six Sigma
Professional Appointments
Expert was active in leadership roles in the Society of Plastics Engineers serving as Polymer Analysis Division Chairman 1990-1992, Treasurer 1993-1999, and was a member of the Board of Directors from 1988-1999.
Product Development and Management Association, Board of Directors, Orange County Chapter, 2009-present
Institute of Management Consultants, Board of Directors, Orange County Chapter, 2009 - Present
Awards / Recognition
Expert was inducted into Sigm Xi, The Scientific Research Society in 1989 and Pi Tau Sigma, Honorary Mechanical Engineering Society in 1977.

National Starch and Chemical Company, CEO Award (2004) presented to the highest performing Strategic Business Unit in the National Starch and Chemical Company. The award was presented to the leadership team of Ablestik Laboratories in recognition for performance excellence in safety, innovation (growth in new products), financial delivery (sales and profitability), and community involvement.

National Starch and Chemical Company, Corky Caldwell Innovation Award for the development of a market-changing new printable paste die attach adhesive achieving greater than $40 million in sales within three years after commercialization.

Honeywell Technical Achievement Award for leading the development of UltraStable BondPly a material and process used to fabricate multilayer flip-chip packaging substrates.

AlliedSignal Management Award for leading the development of FR406BC, an enhanced buried capacitance laminate for multilayer printed circuit boards.

IBM Outstanding Technical Achievement Award for “Development of Lamination Process Fundamentals.”

Three IBM Invention Achievement Awards.

IBM Technical Excellence Award for eliminating defects in the printed circuit board manufacturing process resulting in two year savings of $10 million.

Society of Plastics Engineers Distinguished Service Award for contributions as Chairman of the Polymer Analysis Division from 1990-1992.
Publications and Patents Summary
Expert has published 60 technical papers (including 4 book chapters) in the field of polymeric materials for advanced electronic packaging applications, holds 13 issued US patents, and has 8 patents pending.

Additional Experience

Expert Witness Experience
Provided expert witness analysis and deposition regarding a product liability case where customers were injured due to a product failure. Identified failure mechanism in polymeric materials, provided technical guidance to plaintiff attorney, conducted deposition, eventually leading to a successful resolution and multimillion dollar out of court settlement.
Training / Seminars
Expert has received invitations to speak at prestigious Gordon Research Conferences (Thermosetting Polymers) and has presented numerous lectures and short courses on rheology of thermosetting polymers at national technical conferences. Expert was an Adjunct Professor at Syracuse University in the Dept. of Chemical Engineering and Materials Science from 1986-1993 and taught courses in polymer science. He developed training materials and taught Six Sigma Black Belt and Green Belt at California State University at Fullerton from 2001-2006, and teaches courses on Innovation and Product Development in the MBA program at Concordia University in Irvine, CA.
Marketing Experience
Expert in the area of markets and technology for polymers in electronic applications. Strong knowledge of the market and technology trends in the industry.
Other Relevant Experience
Black Belt in Design for Six Sigma

Fields of Expertise

epoxy adhesive, epoxy curing, epoxy resin, polymeric material curing, thermosetting adhesive, thermosetting material, thermosetting resin, thermosetting substrate, rheological measurement, dielectric thermal analysis, differential-scanning calorimetry, polymer dielectric property, dynamic mechanical thermal analysis, polymer mechanical property testing, polymer physics, polymer thermal analysis, polymer viscoelastic property, thermogravimetric analysis, thermomechanical analysis, electronic encapsulation, electronic product development, printed circuit board product material development, electronic packaging, advanced composite technology, composite prepregging technology, interconnect substrate, adhesion technology, adhesive formulation technology, advanced material technology, electronic packaging technology, microelectronic packaging, semiconductor device packaging process, semiconductor device package, semiconductor device packaging material, thermally conductive coating, innovation, new product development, new product development management, product design variation reduction, stage gate process, technology innovation, design of experiments, statistical design of experiments, portfolio analysis, product evaluation, design technology, adhesive manufacturing, polymer moisture property, analysis of variance, plastic product development, specialty coating material, polymer stress relaxation, polymer heating, barrier polymer, ideation, epoxy encapsulation, semiconductor device thermal management, amorphous polymer, reactive resin, electronic component protective packaging, high-pressure laminate, voice of the customer, epoxy-novolac resin, composite material process optimization, microelectronic device manufacturing, viscometry, aromatic polymer, crystalline polymer, rapid product development, product improvement, process design variation reduction, polymer mechanical property, thermoset foam, chemical research and development, glassy polymer, corporate strategic planning, statistical sampling, oligomer, integrated product development, printed circuit board design-for-manufacturability, flexible circuit technology, advanced material, manufacturing process optimization, material design, design for manufacturability, circuit assembly process, encapsulant, new product assessment, research and development management, technology management, development process, particle characterization, product design, hydrocarbon polymer, response surface methodology, liquid rheological measurement, fluid rheology measurement, biopolymer, technology, organic polymer, high polymer, total quality management, rheology, research management, quality function deployment, process optimization, polymer rheology, polymer coating material, polymer characterization, polyamide, phenolic resin, interpenetrating polymer network, interconnection technology, materials failure analysis, differential thermomechanical analysis, dielectric property, dielectric film

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