Expert Details
Semiconductor Yield, Metal & Material Failure Analysis, Comprehensive Root Cause Analysis
ID: 727218
Minnesota, USA
Expert has an MS in Materials Engineering from UW-Milwaukee and PhD in Metallurgical Engineering from UW-Madison. He is also a certified Professional Engineer since 1997.
His areas of expertise are in engineering compoent & equipment failures, metals, semiconductor and materials. He has performed hands on analysis, testimony and reporting to attorneys on complex cases involved personal injury, property damage, workmen's compensation and product liability.
Expert can provide comprehensive root cause analysis including accident recreation and systematic evaluation of causes for failure. He is the best expert in testifying to jury's on complex engineering failures.
Worked with small businesses, large businesses, foreign suppliers, attorneys and non-profits.
Education
| Year | Degree | Subject | Institution |
|---|---|---|---|
| Year: 1994 | Degree: PhD | Subject: Metallurgical Engineering | Institution: University of Wisconsin - Madison |
| Year: 1988 | Degree: MS | Subject: Materials Engineering | Institution: University of Wisconsin - Milwaukee |
| Year: 1986 | Degree: BE | Subject: Production Engineering | Institution: Anna University, India |
Work History
| Years | Employer | Title | Department |
|---|---|---|---|
| Years: 2008 to Present | Employer: Undisclosed | Title: President | Department: Engineering |
Responsibilities:Expert witness testimonies for attorneys in personal injury, property damage, workmen's compensation and product liability. Comprehensive root cause analysis of failures on complex engineering compoents. |
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| Years | Employer | Title | Department |
| Years: 2008 to 2008 | Employer: Seagate Technology | Title: Senior Engineering manager | Department: Memory Product Group |
Responsibilities:Design test structures for Spin Transfer Torque RAM (STTRAM) devices using magnetic tunnel junctions, automatic electrical testing setup for these structures, specify access transistor for memory element, relaibility of the MgO used in the Magnetic Tunnel Junction and lead a team of engineers. |
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| Years | Employer | Title | Department |
| Years: 1997 to 2008 | Employer: Texas Instruments Inc. | Title: Product Engineering Manager | Department: Foundry Technology Group |
Responsibilities:Rose from Engineer to Manager of Product engineering. Built a team from ground up to perform yield improvement, data analysis, failure analysis, electrical test and design debug.Worked on from 130nm through 32nm CMOS nodes. Designs structures worked on included SRAMs, PLL, Iddq, Speed, Ring Oscillators, and multiple voltage domains. |
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| Years | Employer | Title | Department |
| Years: 1994 to 1997 | Employer: Schevers Laboratories Inc. | Title: Materials Scientist / Owner | Department: Laboratory |
Responsibilities:Start up business in expert witness, metallurgical testing, high technology (space structures, food and plastic injection) metal composite alloying and root cause determination of failures.Performed over 200 failure analysis reports on metallurgical and materials failures. Grew business by 100% in revenue each year until was successfully sold to outside investors. Serviced over 150 customers during this 3.5 years. |
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International Experience
| Years | Country / Region | Summary |
|---|---|---|
| Years: 2003 to Present | Country / Region: China | Summary: Worked with multiple vendors |
Career Accomplishments
| Associations / Societies |
|---|
| Outstanding Student - Guindy Alumni (1986) Fellowship - Am. Foundrymens Society (1988) Principal Investigator - NSF Award (1995) Texas Instruments Tech Ladder 3 times. Indian national Table Tennis Champion (1984-1986) Member of IEEE, AEE, AWEA, MREA, MRES. Senior member at AEE. |
| Licenses / Certifications |
|---|
| Professional Engineer |
| Publications and Patents Summary |
|---|
| He has over 10 papers and presentations and 5 patents in review. |
Additional Experience
| Expert Witness Experience |
|---|
| I have performed scientific and engineering investigations for attorneys in personal injury, property damage, workman's compensation and product liability. |
| Training / Seminars |
|---|
| I have given multiple seminars on semiconductor yield and metallurgical failure analysis. I was one of the key reviewers of papers submitted to the Yield Engineering symposium held in Texas Instruments. |
| Vendor Selection |
|---|
| I have worked directly with vendors and suppliers in China, Taiwan, Singapore and Malaysia. This work has given me the experience to test product to specification and qualify suppliers based on technical criteria and specifications. I am very knowledgeable in the area of product certification as part of shipping and product delivery. |
| Marketing Experience |
|---|
| A thorough engineering professional with expertise in manufacure, process quality, product quality, certification, reliability, testing and certification. |
| Other Relevant Experience |
|---|
| Chemical analysis, Mechanical testing, Electron Microscopy, Optical Microscopy, Electrical leakage testing, Functional testing, DC and AC testing of integrated circuits. |
Language Skills
| Language | Proficiency |
|---|---|
| Hindi | Fluent |
| Tamil |
Fields of Expertise
aluminum casting failure analysis, base metal (welding), bipolar transistor beta (Hfe) degradation, cast iron analysis, composite failure analysis, corrosion, corrosion failure analysis, electric breakdown, electrical equipment failure analysis, electromigration, electronic equipment failure analysis, equipment failure analysis, failure analysis, failure distribution, failure rate, fatigue failure, field-effect device, fractography, gear, gear application, gear failure analysis, gear fatigue, gear wear, known good die, machine component failure analysis, machine failure analysis, materials failure analysis, metal failure analysis, metal semiconductor field-effect transistor, microelectronic device failure analysis, nonferrous metal failure analysis, power semiconductor device quality improvement, printed circuit board corrosion failure analysis, semiconductor defect analysis, semiconductor device, semiconductor device analysis, semiconductor device failure, semiconductor device failure mechanism, semiconductor device manufacturing, semiconductor device package reliability, semiconductor device physics, semiconductor device reliability, semiconductor device selection, semiconductor device testing, semiconductor impurity material, semiconductor integrated processing, semiconductor material manufacturing, semiconductor product quality assurance, semiconductor product quality control, stainless steel failure analysis, steel failure analysis, welding failure analysis, wire rope failure analysis, bipolar complementary metal-oxide semiconductor technology, metal-oxide semiconductor field-effect transistor, metal-oxide semiconductor device, integrated circuit, field-effect integrated circuit