Expert Details
Semiconductor Technology
ID: 729977
Virginia, USA
He received a Master’s degree in experimental physics in 1976, and a Ph.D. in theoretical physics in 1979, both from Tuebingen University, Germany. He has over 27 years of experience in the semiconductor industry, with a specific emphasis on the physics and manufacturing of semiconductor devices and process integration.
From 1979 to 1984, he has held technical positions at Stanford University, Purdue University, and the German Space Agency in Stuttgart, Germany. For the following 27 years he worked in the semiconductor industry, first at Siemens Laboratories (1984–1989, Munich) and then at Motorola Laboratories (1989–2004, Austin, Texas) and Freescale Semiconductor (2004–2008).
Since 2008 he has served as a Professor, where he continues his research in semiconductor device physics and technology. His present research interest are resistive RAM memory devices.
While at Siemens, he conducted research in the physics of metal-oxide semiconductor field effect transistors (MOSFETs). In 1987 he published the first explanation of a fundamental phenomenon known as the “reverse short channel effects,” which has since become a standard feature of all advanced MOSFETs. In 1989 he published an in-depth analysis that correctly predicted degradation effects in MOSFETs.
His research in semiconductor device physics at Motorola had a specific emphasis on non-volatile memories and associated physical effects, such as band-to-band tunneling. In 1990 he was the first to calculate band-to-band tunneling in MOSFETs, and correctly predicted new modes of tunneling including band-to-band tunneling in non-volatile memories.
In addition to conducting research in semiconductor physics, he successfully managed the development of several technologies. For example, while working within the Crolles consortium [Motorola (Freescale), Philips(NXP), and STMicroelectronics, Grenoble, France], he led the development of a 50 nm fully depleted silicon-on-insulator (SOI) MOSFET with TiN/HfO2 gate stack, and a 30 nm gate length SOI MOSFET. While at Motorola he managed several R&D groups. In 1989–1995 I established the first Technology Computer Aided Design (TCAD) Modeling and Simulation group at Motorola. In 1992–1995 he established the first Equipment Modeling and Simulation at Motorola. He successfully managed a Motorola-Freescale program with SOFT-TEC, a company established in 1993 by prominent Russian scientists in collaboration with the Russian Academy of Sciences, comprising 105 engineers and scientists. In 2000, he established the first Design Manual Group as an interface between the CMOS technology development and the circuit design community at Motorola/Freescale.
In 1997 he was elected a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), “for contributions to the MOSFET devices and technology.”
His work in semiconductors is equally divided between device development and process development and process integration. He has developed new modules for poly gate, LOCOS and trench isolation, gate oxide, spacer and liner formation, implantation, diffusion and isotropic and anisotropic (plasma) etching.
He has 99 patents issued, including 69 US patents, being a lead inventor on 69 patents. He has received Motorola’s Distinguished Innovator Award in 1998, and Freescale’s Master Innovator Award in 2007. He has over 150 publications in refereed journals and conference proceedings of which bulk is concerned with semiconductor devices and semiconductor processing.
Consulted for SOITEC company in development of so called engineered wafers. He also advised SOITEC as to the advanced applications of Silicon-on-Insulator (SOI) wafers.Consulted with King and Spalding regarding patent litigation between Spansion and Samsung. He provided short course on Nonvolatile Memory (NVM) memory and history of NVM development. He served as an expert witness and has given sworn deposition and testimony at the trial.Consulted with McDermott Will & Emery regarding patent litigation between Spansion and Samsung. He has written an invalidity, a rebuttal to invalidity, and an infringement expert report.Consulted with Qimonda on DRAM architecture and process technology.Avago Technology v. Maxim Integrated Products litigation, worked on infringement issues for several patents, reviewed literature on tungsten "volcano" effect, reviewed and assessed several patentspatent litigation regarding FinFET transistor Kaist IP v Samsung Electronics; worked on infringement issues of a FinFET patent (2016 - ongoing)
Education
Year | Degree | Subject | Institution |
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Year: 1976 | Degree: Masters | Subject: Physics | Institution: University of Tuebingen |
Year: 1979 | Degree: Ph.D. | Subject: Physics | Institution: University of Tuebingen |
Work History
Years | Employer | Title | Department |
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Years: 2008 to Present | Employer: Undisclosed | Title: Professor | Department: ECE Department |
Responsibilities:teaching and research: lectures for undergraduate, for graduate students, and for Ph.D. candidates. |
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Years | Employer | Title | Department |
Years: 2004 to 2008 | Employer: (Undisclosed) | Title: Department Manager / Director | Department: Research Laboratories |
Responsibilities:CMOS telechnology development: development of next generation devices (MOSFETs, FinFETs floating gate devices, capacitors, diodes, bipolar, SRAM, DRAM FLASH:NAND and NOR).Process development and process integration. Device, process, and equipment modeling. |
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Years | Employer | Title | Department |
Years: 1989 to 2004 | Employer: (Undisclosed) | Title: Section MGR / Department MGR / Director | Department: Research Labs |
Responsibilities:CMOS telechnology development: development of next generation devices (MOSFETs, FinFETs floating gate devices, capacitors, diodes, bipolar, SRAM, DRAM FLASH:NAND and NOR).Process development and process integration. Device, process, and equipment modeling. |
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Years | Employer | Title | Department |
Years: 1984 to 1989 | Employer: (Undisclosed) | Title: section manager | Department: RResearch Labs (Germany) |
Responsibilities:CMOS Technoly: 1Mb 4Mb and 16 Mb DRAM development;MOSFET modeling and simulation; Process modeling and simulation (implantation, diffusion, oxidation, etching). |
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Years | Employer | Title | Department |
Years: 1983 to 1984 | Employer: (Undisclosed) | Title: Researcher | Department: Research Labs |
Responsibilities:Experiments with fuel combustion and flame propagation. |
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Years | Employer | Title | Department |
Years: 1982 to 1983 | Employer: (Undisclosed) | Title: Research Associate | Department: Physics Department |
Responsibilities:Research in nuclear physics, few-body clusters, calculation of bound states, and scattering cross-sections. |
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Years | Employer | Title | Department |
Years: 1981 to 1982 | Employer: (Undisclosed) | Title: Postdoctoral Position | Department: Stanford Linear Accelerator Center |
Responsibilities:Cluster physics, light nuclei, cluster theory. |
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Years | Employer | Title | Department |
Years: 1979 to 1981 | Employer: (Undisclosed) | Title: Assistant Professor | Department: Institute of Physics |
Responsibilities:Physics lectures and seminars, research in nuclear physics. |
International Experience
Years | Country / Region | Summary |
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Years: 1995 to 1998 | Country / Region: Russia | Summary: Established a Motorola research lab in Moscow and became its first director. He helped establish a Russian company SOFT-TEC that was formed within the Russian Academy of Sciences. He established collaboration with leading Russian universities in Moscow, St. Petersburg, Novosibirsk and Taganrog. At the end the Motorola Research Lab in Moscow had 40 researchers. 200 scientists were working for Motorola as contractors. |
Years: 2006 to 2007 | Country / Region: France | Summary: Was a Fresscale expatriate to the Crolles II alliance in Grenoble, France which was made up of Motorola (Freescale), Philips(NXP), and STMicroelectronics. He led the development of a 50 nm fully depleted silicon-on-insulator (SOI) MOSFET with TiN/HfO2 gate stack, and a 30 nm gate length SOI MOSFET and was one of 6 research directors of the alliance. He had interacted frequently with French officials of the research and industry ministries in Paris and with some officials in Brussels, who coordinated EU-sponsored research programs. |
Years: 1994 to 1989 | Country / Region: Germany | Summary: After attending schools and having studied in Germany, Expert's first industrial employer was Siemens company, in the semiconductor sector. He worked for five years in Siemens research laboratories in Munich. |
Years: 2014 to 1915 | Country / Region: Italy | Summary: Fulbright Fellow and Distinguished Professor at Politecnico di Torino. Collaborated with Italian researchers at Politecnico di Torino, Politecnico di Milano, University of Bologna, University Of Trento and with Bruno Kessler Foundation in Trento. Research was on new devices for non-volatile memory including resistive switching and memristors. |
Career Accomplishments
Associations / Societies |
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Expert belongs to IEEE and has the rank of IEEE Fellow;he is a member of the Electrochemical Society and Electron Device Society. 20XX Fulbright Eminent Chair Fellow at Politecnico di Torino, in Turin, Italy |
Professional Appointments |
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Virginia Microelectronics Consortium Chair; Referee for IEEE Electron Letters, Applied Physics Letters, Journal of Electrochemical Society, Journal of Applied Physics, Solid State Electronics, Physical Review C, and Physics Letters. Book Reviewer for IEEE Circuits and Devices. Adviser to the IEEE EDS Fellow Evaluation Committee (2000 – present). Chairman of sessions at several international conferences. Published interviews with trade publications such as International Semiconductor. |
Awards / Recognition |
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20XX Fulbright Eminent Chair Fellow 20XX Master Innovator Award Freescale (there were 15 Master Innovators at Freescale, a company of 24,000 employees). 19XX Platinum Silver Quill (Publication) Award Motorola. 19XX Fellow of Technical Staff Motorola/Freescale. 19XX Distinguished Innovator Award Motorola. 19XX IEEE Fellow Award, citation: for contributions to the modeling of MOSFET devices and technology (IEEE - Institute of Electrical and Electronics Engineers). 19XX Scheffel Award (for the best final high school exam in the state of Baden-Wuertemberg). |
Publications and Patents Summary |
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Expert has over 100 patents (US, Europe, Japan, Taiwan, South Korea) including 84 US patents issued. About 6 patents are pending. He has over 200 publications in leading scientific/technical journals and proceedings of premier conferences. |
Additional Experience
Expert Witness Experience |
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From December 2009 untill June 2011 he had been working on the patent litigation case between Spansion and Samsung. From 12/2009 till 5/2010 he was working for King & Spalding law firm, from 5/2010 till 6/2011 for McDermott Will & Emery. Expert has written expert reports regarding alleged invalidity of patents, regarding infringement of a patent by products, regarding claim construction. He has given sworn deposition (over 7 hours) and given testimony at the trial (ITC court in Washington). |
Training / Seminars |
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Expert has given training seminars on non-volatile memory devices, NAND and NOR architecture. |
Vendor Selection |
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Expert has selected vendors for several pieces of semiconductor equipment and purchased it from my university funds: Rapid Thermal Processing (RTP), Atomic Layer Deposition (ALD), plasma etching, and plasma deposition. He has received as a donation from Freescale probe station for his laboratory. |
Marketing Experience |
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Expert has been involved in strategic planning in semiconductor industry for the last 12 years. He has been chairman of patent committee at Freescale and chairman of the patent brain storming committee. He has supported IP department at Motorola/Freescale in enforcing our patents in the industry. |
Other Relevant Experience |
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Expert has been working for Motorola in Russia for 2.5 years where he has established the Moscow Research Lab for Motorola. During his stint in Moscow he came to understand the semiconductor resources in Russia, both in academia and in the industry. He has been working for Fresscale in Grenoble France as a director of SOI reserach for the Crolles II consortium (Motorola/Freescale, STMicroelectronics, Philips/NEXT). He came to understand the management of the consortium and the French policy approach. He had regularly to report about progress of the research to the French ministry of Industry in Paris. |
Language Skills
Language | Proficiency |
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German | Fluent in speech and writing |
English | Spent 24 years in the US as a postdoc, research associate and a professional. |
Polish | Fluent in speech and writing |
Russian | Understands written Russian; he is a fair speaker of Russian. |
Fields of Expertise
complementary metal-oxide semiconductor device, complementary metal-oxide semiconductor integrated circuit, flash memory, metal semiconductor field-effect transistor, metal-insulator semiconductor device, metal-nitride-oxide semiconductor, metal-oxide semiconductor device, metal-oxide semiconductor material, non-volatile memory, semiconductor device, semiconductor device modeling, semiconductor device physics, semiconductor diffusion, semiconductor dopant lateral diffusion, semiconductor doping, semiconductor etching, semiconductor integrated processing, semiconductor ion implantation, semiconductor process modeling, semiconductor technology, semiconductor thermal oxidation, semiconductor wafer processing, lift-off (semiconductor fabrication), semiconductor wafer contact etching, semiconductor device thermal management, semiconductor device testing, hard semiconductor mask, drive diffusion, predeposition diffusion, semiconductor wafer mask aligner, semiconductor wafer epitaxial deposition, rapid thermal semiconductor wafer processing, semiconductor wafer etching, semiconductor inversion layer, semiconductor fabrication clean-room management, semiconductor device reliability, semiconductor material characterization, semiconductor material processing, semiconductor wafer decontamination, semiconductor wafer cleaning, static random-access memory, semiconductor device analysis, semiconductor processing equipment, memistor, semiconductor mask, doped semiconductor