Expert Details

Semiconductor Industry Technology, IC Process & Manufacturing, HW Systems Specialist with Patents

ID: 731865 India

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Expert is a Board of Director/Technical Advisor in several start-up Technology firms. As Chief Technical Advisor to a Venture/PE fund, he evaluated several Technology companies in the areas of Software, Semiconductor and System HW. He is also associated as the Partner and Chief Technology Officer at an investment company in India. He was Chief Operating Officer of a private equity fund. Expert has worked in High-Tech companies focused on Semiconductor/HW industry for nearly two decades, both in US and India. He was selected to strategize and setup SanDisk India operations in the areas of R&D, Sales/Marketing and Partner relationships. Today, SanDisk India has over 350 top-notch engineers, filed several patents and reached Retails/OEM sales well over USD 100 Million. Expert played a key role in forging partner relationships with companies like Wipro and HCL to outsource Engineering and IT turnkey projects. He was a Department Manager overseeing Broadband/Wireless Silicon development groups in Texas Instruments in India. Expert worked in Intel Corporation and focused NOR/NAND Flash Memory Design and development, High Speed Interface design links like USB 2.0, SATA, PCI - Express and Gigabit interfaces. Expert worked in cross-functional teams to define advanced Silicon process working with Silicon Foundry (aka Fab) Engineers. His expertise extends into Semiconductor eco-system like EDA tools, Process Engineering, PCB, Signal Integrity issues, Chip Packaging, Testing and Assembly. He actively interfaces in various industry forums in India, having been part Minister level investment delegations. Expert has authored/co-authored nine patents in Semiconductor design/HW systems. He received National Technology Award from President of India and IEEE award for innovation.

He has applied his Electrical Engineering knowledge in multiple world renowned Semiconductor companies (Intel, Texas Instruments and SanDisk) to develop new semiconductor and HW products. Expert has a good mix of experience in R&D Program Management, IC Manufacturing & Testing and Technical Marketing. He often led Cross-functional teams to define new product road maps, develop cutting edge process technology, introduce new concepts to reduce manufacturing ramp time. He is professionally well networked in Semiconductor Industry, both in US and Asia and over the years, he developed good insight into competing technologies, end user applications and converging market trends for these products. In addition, he is actively networked with Educational/Research Institutes working on cutting technologies in this space.

Expert has 20 years of Industry experience in IC Design. He started his career as IC Designer and designed several Chip families in the areas of Memory, CPU chipset ICs and Mixed Signal Communication ICs. Expert has thorough understanding of various IC design process, Device performance, CAD tool flow, trade-offs, Design for HVM and reliability and has received 9 US patents for his IC design work. In addition, He has macro level understanding of IC design flow, IC Packaging etc. and the latest trends in this area

Education

Year Degree Subject Institution
Year: 1994 Degree: MSEE Subject: Electrical Engineering Institution: University of Utah
Year: 1991 Degree: BSEE Subject: Electronics & Communication Engineering Institution: College of Engineering, Guindy, Anna University

Work History

Years Employer Title Department
Years: 2013 to Present Employer: Undisclosed Title: Partner & CTO Department:
Responsibilities:
Evaluate Start-up Technology companies in the space of SW and HW areas and make recommendations for investment. Coduct Technical Due Diligence. Provide Technical Advisory if necessary
Years Employer Title Department
Years: 2009 to 2012 Employer: Azure Capital Advisors Pvt Ltd Title: ED & Chief Operating Officer Department:
Responsibilities:
Responsible for Fund setup, Fund raising and project execution
Years Employer Title Department
Years: 2005 to 2009 Employer: SanDisk Corporation Title: Country Head - Head Department: India Ops
Responsibilities:
He was responsible for SanDisk India operations strategy, execution in the areas of R&D (NAND Memory, Controllers, Embededded SW and SSD), Engineering & IT Outsourcing, Sales Marketing(Retail and OEM), Partner relations and Industry & Government relations. Responsible for General Management in the areas of HR, Policies and Training.
Years Employer Title Department
Years: 2003 to 2005 Employer: Texas Instruments Title: Department Manager Department: Broadband & Wireless Group
Responsibilities:
He managed a Worldwide Engineering group to develop Broadband ICs and Systems. He was In-charge of Silicon IP procurement and Silicon Foundry relations
Years Employer Title Department
Years: 1995 to 2003 Employer: Intel Corporation Title: Program Manager Department: Flash Memory & CPU Chipsets
Responsibilities:
Expert as R&D Program Manager to developed Flash Memory (NOR) ICs and CPU chipsets. In addition, he was responsible for taking several Chip families into High Volume Manufacturing and Testing. He proved his mettle in advanced R&D programs involving Semiconductor Process Engineering, EDA tools, Signal Integrity, Chip packaging and Testing and successfully executed. Expert received 9 patents during his tenure. As Intern Manager, he recruited and trained close 25 Engineers from leading campuses like UC Berkelely, Stanford etc...
Years Employer Title Department
Years: 1993 to 1995 Employer: Flextronics Semiconductor Inc Title: Design Engineer Department:
Responsibilities:
He was responsible to develop Mixed Signal ICs
Years Employer Title Department
Years: 1992 to 1994 Employer: University of Utah Title: Research Assistant Department: CVRI
Responsibilities:
He pursued his research in the areas of Signal Processing. While employed at CVRTI, Expert assisted hi Professor to develop signal processing techniques to analyze ECG

Career Accomplishments

Associations / Societies
Active Member in Industry Bodies IESA, CII, TiE and NASSCOM
Awards / Recognition
National Technology Award from President of India. IEEE Vincent Bendix award
Publications and Patents Summary
Expert authored/co-authored 9 US Patents (Issued)

Fields of Expertise

application-specific integrated circuit, complementary metal-oxide semiconductor device, complementary metal-oxide semiconductor integrated circuit, device physics, digital circuit design, digital computer, digital integrated circuit, integrated circuit, integrated logic circuit, integrated-circuit chip, metal-oxide semiconductor device, metal-oxide semiconductor integrated circuit, mixed-signal integrated circuit, semiconductor chip, semiconductor device, semiconductor device manufacturing, semiconductor device modeling, semiconductor device physics, semiconductor die, analog circuit design, silicon chip, transistor, integrated-circuit design, radio frequency integrated circuit, semiconductor device failure mechanism, semiconductor wafer inspection, custom integrated circuit, copper lead frame, Analog Workbench, chip-and-wire, programmable chip, bipolar complementary metal-oxide semiconductor technology, semiconductor wafer measurement, discrete semiconductor device, semiconductor device package sealing, semiconductor device thermal management, semiconductor device testing, semiconductor device package modeling and simulation, semiconductor device packaging material, semiconductor device package reliability, HSPICE software, chemical vapor deposition precursor material, integrated-circuit package, semiconductor device package, memory packaging, computer clock rate, active region, PSPICE software, very high-density integrated circuit, semiconductor device electrostatic discharge protection, semiconductor wafer fabrication facility, application-specific integrated circuit testing, binary digit, digital data acquisition, semiconductor device failure, digital data, semiconductor wafer processing, semiconductor wafer etching, bipolar integrated circuit technology, risk characterization, semiconductor wafer polishing, integrated-circuit built-in self test, power semiconductor device new product development, semiconductor device reliability, hybrid microcircuit, analog signal processor, plastic semiconductor device package, silicon semiconductor growth, boundary scan test, wide band gap semiconductor material, power semiconductor device, digital signal processing chip, characterization process, flip chip, semiconductor assembly engineering, digital signal, silicon-on-sapphire integrated circuit, computer-aided integrated-circuit design, computer-aided design, cofired multilayer ceramic packaging material, computer processor architecture, semiconductor device packaging process, very high-speed integrated circuit, metal-insulator semiconductor integrated circuit, light-emitting diode, integrated circuit testing, integrated circuit selection, integrated-circuit packaging process, high-frequency semiconductor, analog-signal processing, digital-to-analog conversion, semiconductor device analysis, analog-to-digital conversion, metal-oxide semiconductor material, integrated circuit assembly, charge-storage diode, analog signal, Boolean algebra, metal semiconductor field-effect transistor, photoelectric cell, thin-film integrated circuit, semiconductor diode, semiconductor device selection, photodiode, metal-insulator semiconductor material, microwave integrated circuit, linear integrated circuit, hybrid integrated circuit, high-frequency integrated circuit, field-effect integrated circuit, digital signal processing, semiconductor diffusion, current-mode logic, chip-on-board technology, central processing unit

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