Intellex Acquires Expert by Big Village

We're thrilled to announce that Intellex has acquired Expert by Big Village, effective March 22, 2024. This strategic move enhances our capabilities and strengthens our commitment to delivering exceptional solutions to our customers.

Stay tuned for more updates on how this acquisition will benefit our clients and experts.

For inquiries or more information, please contact us at info@intellex.com.

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Expert Details

Electronics Design and Manufacture Reliability, Failure Analysis, Asia Manufacturer Risk Management

ID: 727301 Washington, USA

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Expert has over 20 years of expanding responsibilities in the research and engineering of reliability risk identification, analysis, quantification and mitigation in the context of product and technology development. He is responsible for both technical and organizational leadership and technical execution. He has founded reliability and failure analyses programs and teams for multiple P&L businesses involving consumer, medical and infrastructure electronics. He also consulted for over 40 companies including aerospace, energy, medical and telecommunication industries. His core expertise and skills include Reliability Program Establishment (Reliability process/program development and training, Reliability goal setting and allocation, Concurrent engineering implementation); Reliability Quantification (Reliability predication methodologies, Reliability specification, Statistical data analyses, Assembly process reliability evaluation); Reliability Methodology (Design for reliability methodologies, e.g., PoF, FMEA, DOE; Sensor applications in reliability assessment; System application-specific electronic, mechanical, thermal and optical design risk assessment), Reliability Test (Accelerated testing methodologies; Failure mechanism driven test planning; HALT and verification tests; ESD/latch-up and other IPC/IEEE test standards); Failure Analysis (Failure isolation and analysis; Functional and parametric measurement; Construction analyses; Device Degradation and Failure Signature Analyses); Component Technology (Active and passive device physics and characterization, packaging and interconnection risks; Uprating and derating, etc.); and Supply Chain (Supplier quality and reliability assessment, supplier selection and qualification, supplier management and improvement).

Expert has extensive reliability experience with consumer, computer, communication, medical and electronics components manufacturers in US, Europe and Asia. He is bilingual and is fluent in Chinese. Additionally, he holds over 30 patents in the areas of optics, computer inputs and printing, etc.

Array

Consulted for Asian components and system manufactureres (e.g., opto-electronics, assembly ESD program, PFMEA)
Consulted for Medical and telecom businesses in addition to consumer/computer and communication industries (e.g., root cause analysis, new technology reliability assessments)

Education

Year Degree Subject Institution
Year: 1991 Degree: PhD Subject: Physics Institution: CUNY
Year: 1986 Degree: BS Subject: EE Institution: Tsinghua University

Work History

Years Employer Title Department
Years: 1998 to 2009 Employer: Microsoft Title: Principal Engineering Manager Department:
Responsibilities:
Available upon request.
Years Employer Title Department
Years: to Present Employer: Undisclosed Title: Reliability Physicist Department:
Responsibilities:
Available upon request.
Years Employer Title Department
Years: 2009 to 2011 Employer: DfR Solutions Title: Director and Sr. Member of Technical Satff Department:
Responsibilities:
Reliability consulting and training for international clients. Business developments for US west coast and Asia

Government Experience

Years Agency Role Description
Years: 1987 to 1993 Agency: Brookhaven National Lab Role: Researcher Description:

International Experience

Years Country / Region Summary
Years: 1995 to Present Country / Region: China, Taiwan, Hong Kong, Japan, SIngapore Summary:
Years: 1998 to Present Country / Region: Germany, France, Malta, Denmark Summary:
Years: 1991 to Present Country / Region: USA Summary:

Career Accomplishments

Associations / Societies
IEEE, SMTA, IPC
Awards / Recognition
CEO Quality Award
Publications and Patents Summary
He currently has 16 refereed publications in professional journals and book chapters and over 30 issued US patents

Additional Experience

Training / Seminars
Design for reliability
FMEA
Reliability assessments
Opto-electronics reliability
Establishing Effective Reliability Programs
Vendor Selection
Extensive experience in Tier 1/Tier 2/Tier 3 supplier assessment, selection, development and quality/reliability risk management across US, Europe and Asia with heavy focus in Asia. Native speaker of Chinese.
Marketing Experience
Direct experience in consumer/computer hardware, medical and telecommunication industry including and consulting experience in aerospace, energy, industrial equipment industries.

Other Relevant Experience
Holder of over 30 US patents in the area of new IT device and applications

Language Skills

Language Proficiency
Chinese Native

Fields of Expertise

computer system reliability improvement, electrical product reliability improvement, electronic device quality assurance, electronic device reliability, electronic-device-component life-prediction methodology, electronics reliability testing, electrostatic discharge prevention, environmental-stress screening, failure modes and effects analysis, failure rate, product reliability, product reliability improvement, product reliability plan, quality reliability, quality reliability plan, reliability, reliability analysis, reliability engineering, reliability improvement, reliability plan, reliability prediction, reliability test, reliability testing, reliability theory, semiconductor device reliability, system reliability, accelerated aging, engineering quality assurance, forensic materials failure analysis, medical device hazard analysis, medical device manufacturing troubleshooting, medical device reliability testing, medical device safety, medical device shelf life, quality auditing, quality engineering, quality improvement, supplier quality assurance, supplier quality engineering, supplier quality improvement, supplier risk assessment, evidence, eyewitness reliability, silicon component reliability, bipolar transistor beta (Hfe) degradation, electrical laboratory, casing reliability, automobile reliability testing, printed circuit board reliability, surface-mount assembly reliability, failure distribution, electrical leakage, integrated-circuit reliability, computer reliability prediction, accelerated solder joint testing, case temperature, battery degradation, electrical contact material, electrical connector reliability, semiconductor device package reliability, acceptance test, acceptable quality level, equipment maintenance, battery reliability, bearing reliability, capacitor testing, plastic encapsulated microcircuit reliability, printed-wiring board reliability, electrical connector corrosion, crystal environmental-stress screening, crystal reliability, electronic assembled device reliability, ceramic material reliability improvement, solid electrolyte tantalum capacitor reliability improvement, solid electrolyte tantalum capacitor reliability, ceramic capacitor reliability improvement, capacitor reliability improvement, mechanical product reliability improvement, microelectronic device reliability improvement, microcomputer system reliability improvement, minicomputer system reliability improvement, electronic device reliability improvement, transistor reliability, electric conductor failure, mechanical reliability, electrical product research and development, capacitor reliability, ceramic capacitor reliability, telecommunication system electrical reliability, computer system electrical reliability, electronic component defect, creep-induced solder joint failure, electronic circuit element testing, surface-mount solder joint reliability, solder joint reliability, electronic component processing, electrical product development, electronic-component environmental protection, equipment failure analysis, fault tree analysis, electromigration, design engineering, computer system, electronic assembled device, electronic device, crystal defect, electronics testing, electrical connector, derating, computer data storage, ceramic capacitor, capacitor

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