Expert Details
DRAM Design, Packaging, Modules, and Standards
ID: 727816
California, USA
Expert Witness for FTC case involving DRAM patents and royalties Expert Witness for court case involving DRAM patents and royaltiesMemory module design and standardization for packaging companySystems analysis and training for memory subsystems for telecommunications companyMemory training for memory company
Education
Year | Degree | Subject | Institution |
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Year: 1988 | Degree: None | Subject: Computer Sciences | Institution: Oregon Graduate Center, University of Portland, Stanford, Mission College |
Work History
Years | Employer | Title | Department |
---|---|---|---|
Years: 2001 to Present | Employer: Undisclosed | Title: Memory Technology Analyst | Department: |
Responsibilities:Systems analysis, design, training for computer memory subsystems, focus on high density, low power, and requirements for servers and telecommunications. |
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Years | Employer | Title | Department |
Years: 2007 to 2007 | Employer: US Modular | Title: VP Engineering | Department: Engineering |
Responsibilities:Manage specification and design of all custom products, work with sales and marketing to evangelize |
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Years | Employer | Title | Department |
Years: 2005 to 2007 | Employer: SimpleTech | Title: VP DRAM Technology | Department: Engineering |
Responsibilities:Manage specification and design of all custom products, work with sales and marketing to evangelize |
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Years | Employer | Title | Department |
Years: 2002 to 2005 | Employer: Netlist | Title: Senior Memory Technology Analyst | Department: Marketing |
Responsibilities:Manage specification and design of all custom products, work with sales and marketing to evangelize |
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Years | Employer | Title | Department |
Years: 1997 to 2002 | Employer: Transmeta | Title: Memory Technology Specialist | Department: Engineering |
Responsibilities:Define and drive standardization of chosen memory technology |
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Years | Employer | Title | Department |
Years: 1995 to 1997 | Employer: S3 | Title: Graphics Architecture Specialist | Department: Sales |
Responsibilities:Define and drive standardization of chosen memory technology |
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Years | Employer | Title | Department |
Years: 1974 to 2005 | Employer: Intel | Title: Field Applications Engineer | Department: Sales |
Responsibilities:Support strategic accounts for all 20,000 Intel products |
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Years | Employer | Title | Department |
Years: 1988 to 1989 | Employer: Octel | Title: Diagnostic Engineer | Department: Engineering |
Responsibilities:Write diagnostics and system bootstrap for voicemal system |
International Experience
Years | Country / Region | Summary |
---|---|---|
Years: 2002 to 2005 | Country / Region: China | Summary: Worked with Chinese government on adoption of JEDEC standards; key input to their entry into the World Trade Organization |
Years: 2006 to Present | Country / Region: China | Summary: Training and technical advisor to major Chinese telecommunications company |
Years: 1996 to Present | Country / Region: Japan | Summary: Partner to JEITA standards organization on development of memory modules for Japanese markets |
Years: 1995 to 2002 | Country / Region: Taiwan | Summary: Training and sales advisor to Taiwanese sales teams for his companies |
Years: 2005 to 2007 | Country / Region: Europe | Summary: Technology presentations and training with international sales team |
Career Accomplishments
Associations / Societies |
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JEDEC |
Professional Appointments |
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JEDEC Board of Directors |
Awards / Recognition |
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Technical Recognition Award Chairman's Award |
Publications and Patents Summary |
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10 patents granted, 3 patent applications pending 4 published articles |
Additional Experience
Expert Witness Experience |
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Expert witness for FTC case involving intellectual property usage and payment of royalties |
Training / Seminars |
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DRAM from SDRAM through DDR4 DRAM Modules and By-Market Analysis Flash Memory and Modules |
Marketing Experience |
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Speaker for industry conferences including Platform, Via Technology Forum, Denali MemCon, Consumer Electronics Show |
Other Relevant Experience |
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Hold many patents in circuit design and packaging |