Expert Details
Quality Engineering, Semiconductor Packaging & Automotive Industry Specialist
ID: 740177
United Kingdom
At Sensata Technologies, where he worked for 23 years, Expert served as a Subject Matter Expert in semiconductor packaging, particularly in the assembly and qualification of SiP, SiC, MEMS, and custom advanced packaging solutions. He led the development and implementation of robust quality management systems (QMS) that complied with industry standards such as ISO 9001, IATF 16949, and ISO 45001, helping maintain a near-zero field failure rate (less than 0.5 ppm) for products used in automotive applications.
Expert also managed critical aspects of process engineering, quality assurance, failure analysis, and customer relations, working with prominent automotive manufacturers like BMW, Nissan, Ford, and Hyundai. He led global supplier audits and ensured compliance with quality standards through continuous improvement and defect prevention strategies.
Prior to Sensata, Expert held senior quality engineering roles at Faurecia, Lucas EUI Systems, and Lydmet Ltd, where he established and led quality control systems, supplier development, and customer support in highly competitive industries. His expertise includes failure mode and effects analysis (FMEA), statistical process control (SPC), advanced product quality planning (APQP), and business continuity planning.
Education
| Year | Degree | Subject | Institution |
|---|---|---|---|
| Year: 1983 | Degree: HND | Subject: Cat Metal Technology | Institution: Mid-Gloucester College |
Work History
| Years | Employer | Title | Department |
|---|---|---|---|
| Years: 2024 to Present | Employer: Undisclosed | Title: Semiconductor Consultant | Department: |
Responsibilities:Engineering quality management for Semiconductor Industry. |
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| Years | Employer | Title | Department |
| Years: 2000 to 2023 | Employer: Sensata Technology Ltd. (Formerly Swindon Silicon Systems) | Title: Quality Engineering Manager | Department: |
Responsibilities:• Led a team of professional engineers, representing Process Engineering, Reliability & Qualification, Failure Analysis, Quality Assurance and Control.• Management of customers including Ford, Mercedes, Hyundai, Nissan, and Great Wall. • Involved with the problem solving and development of preventive and corrective action programs to resolve end-customer concerns. • NPI Team member from start of project, including feasibility, process, product and supplier selection. Provided process control, APQP, qualification & reliability for all company projects and product change management. • Semiconductor Assembly Subject Matter Expert embedded in all SIC. SIP, MEMS, Discrete and Custom Advanced Packaging. • Spearheaded product development initiatives in response to customer concerns, audit findings, and supplier improvement efforts, focusing on defect prevention, process yield enhancement, and the creation of comprehensive supplier development roadmaps and Business Continuity planning. • Developed and amalgamated QMS/EMS/EHS procedures and systems that served as a complete Business Management System, compliant with ISO9001, ISO/TS16949, ISO45001 & ISO14001. |
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| Years | Employer | Title | Department |
| Years: 1996 to 2000 | Employer: Faurecia | Title: Senior Quality Engineer | Department: |
Responsibilities:• Supervised a team of quality engineers establishing a QS9000 culture in an automotive seating manufacturing facility. Deputized for the Quality Manager working directly with senior management team on a daily basis.• Created and implemented all quality control systems and methods of a new manufacturing facility to produce high quality components for Honda and Rover. • Directly responsible for quality of all new product implementation including (advanced product quality planning), PPAP (prototype product approval process), process FMEA (failure mode and effects analysis), SPC (statistical process control) & MSA (measurement system analysis). Lead auditor for internal and supplier audits covering all aspects of quality. • Drove continuous improvement and supplier development programs. Incorporated co-ordinate measurement into the production line. Controlled to ensure, high dimensional capability and meet ever more stringent quality requirements. Developed quality training programs for all levels of personnel within the business. |
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| Years | Employer | Title | Department |
| Years: 1992 to 1996 | Employer: Lucas EUI Systems | Title: Senior Quality Engineer | Department: |
Responsibilities:• Responsible for the successful implementation of ISO 9001 & RG 2000 for the manufacturing and design sites of high precision components for electronic injection units, both machine manufacture and assembly.• Developed and implemented a continuous improvement program dealing with all aspects of quality, resulting in a significant reduction in quality rejects, benchmark quality systems and improved customer relations. • Managed quality management reviews reporting directly to the Board of Directors covering all aspects of quality and continuous improvement. • Served as the AQP engineer for new truck products, responsible for the full spectrum of quality assurance and control in a high precision automated machining, assembly and test plant, responsible for its own design and development serving the diesel automotive industry. • Implemented training programs on quality skills developing the quality culture for a quick response continuous improvement environment at all levels of the business. |
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| Years | Employer | Title | Department |
| Years: 1989 to 1992 | Employer: Lydmet Ltd. | Title: Q1 Coordinator | Department: |
Responsibilities:• Successfully implemented Ford Q1 and IS09002 quality systems into one of the most technologically advanced foundries in Europe, regularly audited and approved by customers world-wide, including Nissan, Ford, Volvo and Expert Deere.• Developed state of the art gauging methods including image analysis, CNC profile measurement, and developing computer interface gauging in a wide range of quality control activities. • Introduced statistical process control to a large variety of quality control systems of a high repetition foundry manufacturing automotive components. |
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| Years | Employer | Title | Department |
| Years: 1987 to 1989 | Employer: Cannop Foundry | Title: Quality/Technical Manager | Department: |
Responsibilities:• Recruited to implement quality systems to IS09000 standard, significantly improving metallurgical and dimensional control of a wide range of general engineering castings supplied to a variety of manufacturing industries.• Established metallographic inspection methods to enable production of a wide variety of cast iron structures (including SG iron), and introduced statistical analysis for metallurgical and dimensional control. |
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| Years | Employer | Title | Department |
| Years: 1985 to 1987 | Employer: Lydmet Ltd. | Title: Laboratory Supervisor | Department: |
Responsibilities:• Co-ordinated and controlled laboratory activities to provide metallographic inspection and test support to a high repetition ferrous foundry, implementing a variety of control techniques to ensure high standards of material analysis and compliance to stringent specifications.• Completed 4-year indentured foundry technician apprenticeship. |
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International Experience
| Years | Country / Region | Summary |
|---|---|---|
| Years: 2005 to 2023 | Country / Region: Malaysia, Thailand, Singapore | Summary: Audit Suppliers for initial Vendor evaluation, annual assessment & Failure analysis. Escort Customers, Present Project & Failure Analysis material to potential Suppliers. |
| Years: 2010 to 2023 | Country / Region: China | Summary: Audit Suppliers for initial Vendor evaluation, annual assessment & Failure analysis. Present Project & Failure Analysis material to Customers and potential Suppliers. |
Career Accomplishments
| Associations / Societies |
|---|
| International Microelectronics Assembly & Packaging Society – IMAPS (Member) |
Fields of Expertise
advanced semiconductor packaging, semiconductor assembly engineering, process semiconductor, semiconductor defect analysis, semiconductor device failure, semiconductor device failure mechanism, semiconductor device package, semiconductor device manufacturing, semiconductor device, semiconductor device package reliability, Semiconductor Quality control