Expert Details
Thin Films, Vacuum Technology, thin film resistors, semiconductor processing
ID: 108474
New York, USA
Expert has worked in leading positions developing semiconductor process steps and etching techniques, including wet chemical etching. He consults in this area.
As Founder of Thin Film Concepts, Expert is experienced with thin film devices, circuits, and sensors. Expert and engineers at Thin Film Devices are developing metallization and pattering processes for aluminum nitride, alumina, Teflon, etc.
Expert designs and consults on custom vacuum equipment. He has designed large and small chambers for many sputtering and evaporation requirements including vacuum processing. He is knowledgeable regarding vacuum deposition, vacuum measurement, vacuum-compatible materials, and vacuum pumps.
Consulted for a medical device company on the application and processing of thin film and sputtered components.Consulted on the fabrication of thin film device manufacture, and the cost to scale up to high volume production. Consulted on the failure of hermetic seals for optical package windows deposited by thin film and sputtering. Consulted on processes and equipment needed to produce masters for DVD and CD manufacturing. Consulted on processing problems to produce thin film sensors and packages for jet engines.
Education
| Year | Degree | Subject | Institution |
|---|---|---|---|
| Year: 1971 | Degree: Ph.D. | Subject: Materials Science | Institution: M.I.T. |
| Year: 1967 | Degree: B.S. | Subject: Engineering, Science | Institution: New York University |
Work History
| Years | Employer | Title | Department |
|---|---|---|---|
| Years: 2004 to Present | Employer: Undisclosed | Title: President | Department: |
Responsibilities:Consulting on thin film processing, semiconductor processing, assembly, sputtering, evaporation, pvd. etc. |
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| Years | Employer | Title | Department |
| Years: 1991 to 2009 | Employer: Thin Film Concepts, Inc. | Title: President, Director of Engineering | Department: Thin film manufacturing, processing, development, semiconductor processing |
Responsibilities:Responsible for custom circuit manufacture, thin film devices, sputtering, custom evaporation, r and d in thin film device area |
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| Years | Employer | Title | Department |
| Years: 1987 to 1991 | Employer: Microelectronics Laboratory, Columbia University | Title: Associate Director | Department: Materials Science Center |
Responsibilities:Research areas with Fortune 100 companies and government contracts on thin film packaging, sensors and other areas |
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| Years | Employer | Title | Department |
| Years: 1983 to 1985 | Employer: Perkin-Elmer | Title: Product Manager, Manager of Applications | Department: Plasma Systems Division |
Responsibilities:responsible for world wide technical marketing and process development of sputtering systems |
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| Years | Employer | Title | Department |
| Years: 1981 to 1983 | Employer: Siemens | Title: Manager | Department: Wafer Process Devices |
Responsibilities:GaAs laser development |
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| Years | Employer | Title | Department |
| Years: 1976 to 1981 | Employer: Honeywell | Title: Principal Resident Scientist | Department: |
Responsibilities:Responsible for thin film package development |
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| Years | Employer | Title | Department |
| Years: 1971 to 1976 | Employer: Naval Research Laboratory | Title: Research Metallurgist | Department: |
Responsibilities:Development of superconducting resonators for Naval Communications, sputtering of Vanadium Gallium superconductors, development of VGa wire |
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Government Experience
| Years | Agency | Role | Description |
|---|---|---|---|
| Years: 1971 to 1979 | Agency: Naval Research Laboratory | Role: Section Head | Description: Work included conducting research on low-temperature superconductors for communications, the fabrication and testing of vanadium gallium superconducting wire, performing failure analysis, metallography, and working on thin film superconductors. |
International Experience
| Years | Country / Region | Summary |
|---|---|---|
| Years: 1983 to 1986 | Country / Region: Japan, Korea, Europe | Summary: Was product manager for sputtering and plasma equipment, and head of international marketing. |
Career Accomplishments
| Associations / Societies |
|---|
| Expert is a member of IEEE, American Vacuum Society, International Society of Hybrid Microelectronics, and American Society for Metals. |
| Publications and Patents Summary |
|---|
| He is the author of over 25 publications and three patents in superconducting materials. |
Additional Experience
| Expert Witness Experience |
|---|
| Expert was involved in a case pertaining to procedures for CD mastering, licensing, and patent infringement. He worked with a large law firm concerning a fortune 500 patent suit. This work involved writing responses and exhibits, evaluating technical and legal issues, depositions and discovery. His evaluations where used in an eventual settlement. Expert has also worked with lay firms to evaluate restrictive components which would meet the definitions involving in an antitrust suit. |
| Vendor Selection |
|---|
| He has worked for many companies to locate new and used equipment for thin film coating requirements. |
| Marketing Experience |
|---|
| Expert was involved in the international marketing of sputtering and plasma equipment for Perkin-Elmer. |
| Other Relevant Experience |
|---|
| Expert has extensive background in the area of contacts to thin film superconductors and UBCO and thallium-based thin films; the contacts have been as low as 1.5 x 10(-8) ohm-cm(2). He has received research grants and contracts in this area. |
Fields of Expertise
physical vapor deposition, vacuum deposition, sputter deposition, thin-film integrated circuit, ceramic thin film, dielectric film, diode sputtering, electrically conductive film, reactive sputtering, thin film, thin-film analysis, thin-film application, thin-film coating process, thin-film conductor, thin-film deposition, thin-film electrical property, thin-film property, thin-film resistor, vapor deposition, atomic layer deposition, semiconductor processing equipment, wet chemical etching, chemical etching, hybrid microelectronics science, thin-film circuit, thin-film circuit element, thin-film sensor, thin-film technology, vacuum technology, vacuum equipment, vacuum measurement, vacuum pump, vacuum-compatible material, thin film science, wet etching, CD-ROM mastering, CD mastering, deposition analysis, semiconductor industry chemical, semiconductor wafer backside metallizing, hybrid microelectronic device, video disk mastering, nitride compound, electronic packaging, via, ion sputtering, semiconductor material processing, semiconductor wafer cleaning, semiconductor device packaging process, semiconductor device manufacturing, static vacuum maintenance, electron-beam deposition, very large-scale integration, vacuum leak detection, microelectronics thin-film application, integrated-circuit packaging process, interconnection wiring, ion etching, etching, deposition, module, very high-speed integration, transparent conductive thin film, ceramic packaging process, gallium arsenide semiconductor, electric contact, integrated circuit assembly, wire bonding, semiconductor wafer, microelectronics science, thin-film optical property, semiconductor lithography, cryopump, resistor, ultra-high vacuum, thin-film capacitor, semiconductor thermal oxidation, superconductivity, superconducting material, soldering material, semiconductor metallizing, semiconductor device, photoresist, ultraviolet lithography, optical thin film, optical coating material, multichip module, microlithography, magnetic thin film, leak detection, ion pump, interconnection technology, integrated optics, evaporated film, diffusion pump, DC sputtering, coating, ceramic superconductor, ceramic multichip module