Expert Details

Business Mentor and Patent Management Specializing Electronic Assembly (SMT, FPT, Heterogeneous) and Semiconductor Packaging

ID: 716910 California, USA

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Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) contract design and assembly foundry and one of the first chip scale package companies. The contract manufacturing facility utilizes automated assembly lines and computer aided design (CAD) methods to aid in design for surface mount assembly. Expert is an expert in fine pitch and small component soldering techniques for surface mount, and these techniques include work involving solder paste, wave, and multiwave soldering, adhesive attach, and reflow soldering. He has managed product designs and manufacturing groups. His first company, AWI (now SCI's western division), is credited with designing and manufacturing many of the SMT "firsts", such memory and camera modules Others include flex circuits, SMT design and workmanship standards, tablelet computers, SIMM modules, portable medical products, disc drives, multi-chip products, and fine pitch products.

Expert has managed companies starting with as few as two partners up to a team of 250 employees. He has managed large projects with responsibility for forming and coordinating teams from multiple companies and countries. During his active years in business creation and management he has successfully raised equity (VC, Angel, and private), sold companies, and negotiated licensing, debt, leasing, and real estate agreements.

Expert co-founded and managed a company responsible for creating one of largest portfolios of IP for wafer level and related semiconductor packaging technologies. He was directly involved in defending the validity and ownership of this portfolio in multiple litigation which spanned over 6 years. He is the named inventor on six of the >40 patents in the portfolio.

At one of largest EMS companies, he implemented an inhouse (California ETP funded) SPC and Juran Quality training program. This helped this company win the Malcolm Baldridge Award. He has provided management consulting for several leading electronic assembly companies. He list of companies served includes to largest EMS company, the largest OSAT company, and the largest manufacturer of electronic materials. He has provided onsite factory improvement asessments and recovery plans for several companies.One of his recent projects involved helping architect a large (> billion units per year) for a large US maufacturer.Recommended and arranged introductions between a large multi-national product OEM and a large multi-national contract assembler.Engaged to review and select sites and infrastructure to be built by the largest market cap company.

Education

Year Degree Subject Institution
Year: 1979 Degree: M.S.E.M. (M.S.E.E./M.B.A. Equiv.) Subject: Engineering Management Institution: University of Santa Clara
Year: 1970 Degree: B.S. Subject: Electronic Engineering Institution: University of Florida

Work History

Years Employer Title Department
Years: 2009 to 2018 Employer: (Undisclosed) Title: Managing Director Department: (Undisclosed)
Responsibilities:
Providing business and technical consulting.

Specialties include electronic IC package and board assembly
Years Employer Title Department
Years: 1994 to 1998 Employer: (Undisclosed) Title: President Department: (Undisclosed)
Responsibilities:
He was CEO of one of the first WLP companies in the industry. In addition to being CEO, he was a member of the technical team. Was issued 23 WLP patents.
Years Employer Title Department
Years: 1998 to 2001 Employer: (Undisclosed) Title: VP, Business Development Department: IPAC
Responsibilities:
He served in sales, marketing, and new product definition for a large Taiwan-based package assembly subcontractor.
Years Employer Title Department
Years: 1981 to 1986 Employer: (Undisclosed) Title: CEO Department: (Undisclosed)
Responsibilities:
He was co-founder of one of the first SMT EMS companies in the U.S. It was later successfully acquired by SCI.
Years Employer Title Department
Years: 1986 to 1988 Employer: (Undisclosed) Title: Director of Advanced Technology Department: (Undisclosed)
Responsibilities:
Was deployment manager of SMT into SCI's factories.

Additional Experience

Expert Witness Experience
Expert has been and continues to be available as an expert witness.

His prior experience spans several years involving electronic product design, manufacturing disputes, patent infringement, patent ownership, licensing negations, patent validity, Markman Hearing review and preparation, as well as trial review and preparation.

He has actively participated in arbitration, mediation, deposition, patent auctions, patent licensing, Non-disclosure disputes, and non-compete disputes.

Career Accomplishments

Associations / Societies
Expert is a Life Member of IEEE.

Awards / Recognition
Expert has received the IPC President's Award and numerous speaking awards.
He was a Charter Member of the Surface Mount Council.
He was invited to be on the West Coast Advisory Board for College of Engineering, University of Florida

Publications and Patents Summary
He was named inventor on six patents, past co-owner of over 40 patents.

He is the author of the first text about Fine Pitch SMT Technology

He has produced 12 videos published by Society of Manufacturing Engineers.

Fields of Expertise

medical device manufacturing, biomedical device manufacturing, medical device manufacturing automation, biomedical chemical sensor, microelectronic device manufacturing, military electronic equipment, automotive electronic equipment, electronic component product development, business innovation, business divestiture, business acquisition, business management, business development, patent interpretation, electrical device patenting, patentability evaluation, patent prosecution, standards of workmanship, business ethics, small business, project execution planning, plated through-hole via, quad flat pack, business intelligence, chip-and-wire, project assessment, integrated product team, discrete semiconductor device, chip-to-package interconnection, epoxy encapsulation, multichip module application, known good die, leaded chip carrier, automatic soldering, semiconductor device package, printed wiring assembly, electronic component protective packaging, gas etching, chip carrier fabrication, resource planning, application-specific integrated circuit testing, interconnection technology process development, semiconductor cluster-tooling processing, printed circuit board machine project management, electronics research-and-development management, inventor management, multichip module packaging process, corporate strategic planning, competitive analysis, surface-mount technology chip carrier, surface-mount solder joint, fine-pitch soldering, multiwave soldering, flexible circuit technology, manufacturability design review, interconnect substrate, semiconductor assembly engineering, electronic equipment, surface-mount soldering, electronic circuit, electronic module, marketing, printed circuit, electronic assembled device, project scheduling, project planning, planning, microfabrication, integrated circuit, hybrid integrated circuit, flexible circuit, ceramic multichip module, business process re-engineering, bipolar transistor

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