Expert Details
CFC Alternatives, Electronics; Circuit Board; Circuit Board Solvents; Chlorofluorocarbon
ID: 711984
California, USA
Expert set up a process development center (including an analytical support laboratory) for investigating the cleanliness of both conventional printed wiring assemblies (PWAs) and surface mount assemblies (SMAs). He specified all the equipment used in the process development center and has made numerous carefully conduct.
Expert was the director of a process development center devoted to producing and testing conventional through-hole printed wiring assemblies and surface mount assemblies. He managed a department consisting of three engineers, two chemists, and two technicians. He is very familiar with the relevant technical management issues of electronics manufacturing management. He recently wrote a chapter dealing with the technical management of fine pitch technology, a branch of electronics manufacturing of surface mount devices. He has a strong business background and holds an MBA.
Expert, in his capacity as director of a printed wiring assembly and surface mount assembly process development center, specified all necessary processing equipment.
Expert is currently involved with investigating the behavior of surface mount solder joints (SMSJs). Of particular importance is determining the life distribution functions of leadless joints, J-leads, and gull wing leads. He has also studied the detailed metallurgy of solder, especially eutectic or 63% Sn/37% Pb solder. He has read a number of papers on this subject and is currently heading-up an investigation on this subject.
Expert was responsible for process development engineering for evaluating, testing, and developing new industrial solvent cleaning agents and cleaning equipment for the electronics, precision cleaning, and metalworking.
Expert investigated several techniques for detecting and quantifying contaminating species on the surface of electronic boards and assemblies.
Education
Year | Degree | Subject | Institution |
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Year: 1982 | Degree: MBA | Subject: | Institution: Product Operations Management - Florida Institute ofTechnology |
Year: 1974 | Degree: PhD | Subject: | Institution: Chemistry - Johns Hopkins University |
Year: 1964 | Degree: MS | Subject: | Institution: Chemistry - University of Michigan |
Work History
Years | Employer | Title | Department |
---|---|---|---|
Years: 1992 to Present | Employer: Undisclosed | Title: Undisclosed | Department: Undisclosed |
Responsibilities:Available upon request. |
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Years | Employer | Title | Department |
Years: 1984 to 1991 | Employer: Manager, Process Development Engineering, Allied-Signa l | Title: Undisclosed | Department: Undisclosed |
Responsibilities:Available upon request. |
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Years | Employer | Title | Department |
Years: 1982 to 1984 | Employer: Manager, Technology Transfer, Digital Equipment Corp. | Title: Undisclosed | Department: Undisclosed |
Responsibilities:Available upon request. |
Fields of Expertise
chlorofluorocarbon, chlorofluorocarbon substitute, ozone-depleting substance, solder joint, printed circuit board assembly process, printed circuit board cleaning, printed circuit board surface contaminant, printed wiring assembly, printed wiring assembly cleaning, surface-mount cleaning, electronics manufacturing, electronics manufacturing management, surface-mount assembly, surface-mount solder joint, cleaning solvent, metal degreasing, solvent cleaning, electronic assembled device surface contaminant, assembly, surface cleanliness, ozone-depleting substance substitute, eutectic solder, chlorofluorocarbon alternative solvent, lead-free electronic interconnector, electronic packaging, surface-mount component, creep-induced solder joint failure, surface mount water cleaning, fine-pitch soldering, fine-pitch technology, surface-mount equipment, electronic hardware cleaning, substitute solvent, surface mount board design, new product assessment, printed circuit design, printed circuit board soldering, printed circuit board, surface-mount soldering, electronics aqueous solvent, printed circuit, surface-mount technology, fluorocarbon, stratospheric ozone depletion, solder paste, through-hole printed circuit assembly, industrial solvent