Expert Details

Flexible Printed Circuitry, Rigid-Flex Printed Circuitry and Flexible Printed Circuit Materials

ID: 108386 New Hampshire, USA

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Expert has more than 40 years of experience with flexible printer circuitry, with 19 years as Director of R&D. With 21 patents in this area, Expert has extensive knowledge of custom materials, connectors, design, and manufacturing technology. He can answer in-depth questions on flexible circuit substrates. Expert is the co-founder of two flexible circuit companies and the author of a textbook on flexible circuitry.

Expert has worked with process and material development that led to the Zontar process patent, a procedure for manufacturing high-performance, high-yield rigid-flex circuitry using adhesiveless flexible materials and rigid prepregs.

Expert has developed several strip-line flexible circuits, working with design, materials choice, manufacturing technologies, tests, and test fixture design. He is the inventor of the "quilted" configuration for improved flexibility. He also worked on the development and tests for special connectors that control impedance in flexible circuits.

Expert is the inventor, developer, and tester of printed circuit snap-action switches. The process is based on etching a single plane of spring metal, then forming it to create arrays of switches.

After 19 years as a director of research and development, Expert has gained extensive knowledge of product development. He is familiar with exploring and optimizing new ideas for products and methods of manufacture, as well as market research, feasibility, and cost studies. He has worked primarily with electromechanical products, including switches, connectors, and flexible and rigid-flex circuitry.

Evaluation of manufacturing methods and costs for high volume production of medical sensor circuitryAnalyses of materials influence on flexural fatigue failure in printer interconnect circuitry leading to significant improvement in field life.Design and source development for extreme high speed high current test circuitry (semiconductor industry)Design and development of equipment for high volume production of electronic materials by vacuum metalization and roll-to-roll electroplating Research and authoring of presentation to IPC on a new mechanical manufacturing method for producing flex circuitry and "etched heaters."

Education

Year Degree Subject Institution
Year: 1953 Degree: A.B. Subject: Physics Institution: Harvard University

Work History

Years Employer Title Department
Years: 1993 to 2003 Employer: (Undisclosed) Title: President Department:
Responsibilities:
Expert is President and founder of the company.
Years Employer Title Department
Years: 1991 to 1993 Employer: Miraco, Inc. Title: Director of Research & Development Department:
Responsibilities:
Expert directed process and product development in high-density and custom connectors for flat cable and flexible printed circuitry. He also was responsible for the development of a mechanical process for forming conductor patterns in flex circuitry.
Years Employer Title Department
Years: 1988 to 1991 Employer: Interflex Corp. Title: Principal Development Engineer Department:
Responsibilities:
He was responsible for prototype fabrication of unusual flex or rigid-flex circuitry, process/product development, and the management of R&D projects.
Years Employer Title Department
Years: 1982 to 1988 Employer: Advanced Circuit Technology, Inc. Title: Director of Research & Development Department:
Responsibilities:
Expert managed R&D, and worked on innovation and development of high-density connectors for flex and flat conductor cabling.
Years Employer Title Department
Years: 1977 to 1982 Employer: Raytheon Co. Title: Staff Engineer Department: Missile Systems Division
Responsibilities:
He was an intradivisional expert in electronics interconnections technology.
Years Employer Title Department
Years: 1974 to 1977 Employer: Sanders Associates Title: Manager of Research & Development Department:
Responsibilities:
Expert managed R&D projects, and was an
Assistant Licensing Manager (for technology transfers).
Years Employer Title Department
Years: 1970 to 1974 Employer: TME Corporation Title: R&D Department:
Responsibilities:
He developed manufacturing methods and materials for continuous double-clad flex circuit laminate.

Additional Experience

Expert Witness Experience
Expert is an expert witness in patent issues (rigid-flex production and explosive valve actuation).

Career Accomplishments

Associations / Societies
Expert is a member of NECA (Northeast Circuits Association), IPC, IMAPS, and PHSNE (Photographic Historical Society of New England).
Licenses / Certifications
Expert is a USCG licensed Operator.
Awards / Recognition
Expert received the IPC Special Recognition Award for promoting and serving the flex circuit industry.
Publications and Patents Summary
Expert has 22 patents, and is the author of numerous technical papers published by McGraw-Hill.

Fields of Expertise

flexible circuit, flexible circuit design, flexible circuit material, flexible circuit technology, rigid-flex circuit board, flexible circuit impedance control, snap-action switch, electromechanical product development, flex testing, photoetching, flexible printed circuit substrate, wire welding, flexible cable, flexible circuit screen printing, flexible circuit assembly, interconnection technology

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