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Expert R. Expert was a pioneer in the "surface mount revolution" where he developed packaging, interconnect, process, and design technologies to enable high volume, small footprint manufacturing of two-way radios, cellphones, and pagers. He has led green field factory development programs, facilitated factories, staffed factories, and led manufacturing and manufacturing engineering teams. The scope combines NPI, supply chain, board/component design, equipment, processes, reliability, quality, cost reduction, testing, software programming, and customer fulfillment.

Expert developed automated equipment for production processes using custom designs and robotic systems since 1982. Expert was Chairman of Motorola's High Speed (component) Placement Equipment MCOE for two years, where best practices were shared and suggested vendor/equipment lists prepared. Over 500 pieces of equipment were purchased over that period. Expert helped develop the first ball grid array (BGA) bumping robot for the industry. In the past several years, Expert has overseen development and implementation of 15 pieces of automated equipment from thin IC packaging, RFID card lamination, automated RFID card test handler, programmer, marking system, automated coil-winder and Nd-YAG laser bonding, and smart label interposer robot cell using flip chip to paper substrate.

Expert's work as Director of Operations at Motorola Indala, and later as General Manager of Indala, yielded production of >1,000,000 RFID and wireless reader devices per month. Most of the products had a manufacturing cost below $1.00. Extensive optimization of materials, processes, automation, supply chain, and ongoing support was performed on a regular basis to ensure the leanest possible operations. Within eight months as Director of Operations, Expert improved the gross margin percentage from 22 to 37% while improving quality and delivery.

Expert has published numerous papers on solder interconnect technologies and received several patents in this area. His background in metallurgy adapted well to research into surface mount interconnect design for reliability and in creating the design and processes for BGA soldering. This led to other work in low temperature solders with low modulus and high strain-rate capability for severe environments. Metallization schemas to support interconnect cost, processes, and reliability are well known to Expert.

Expert has managed electronic manufacturing operations for 13 years. In all cases, he has fully understood the finances behind operations and worked within the confines of product/business P&Ls to deliver favorable results. He has managed diverse organizations that have implemented new enterprise software, tackled severe quality/shipment issues, implemented process re-engineering for order to cash, and revamped ABC costing for products. With the fundamental technical understanding, Expert was able to provide leadership where team participation was able to deliver great improvement to business goals.

Expert has experience in plant operations when he managed facilitation of several new surface mount and final assembly factories for Motorola. Proper planning and execution led to minimum downtime and disruption to production operations. Budgets were always met. Along with this experience, Expert created a new manufacturing facility for smart cards, where 25,000 square feet were constructed and populated with equipment and elaborate security designs that met specifications of Visa and MasterCard.

Expert began doing PCB assembly with surface mount packages in 1982 and later grew that experience into a leadership role to the rest of Motorola. Expert's research into solder joint reliability using FR4 vs. polyimide (with less TCE) saved hundreds of thousands of dollars. Expert was principal designer for inverse reflow interconnect design for heavy components which used surface tension to prevent falling off during upside-down reflow. Expert also developed design guidelines for BGAs within Motorola, and championed the board level assembly of these devices. His expertise includes PCB manufacture, finishes, solder masks, tolerances, balanced designs, heat sinking, and panelization. Expert created many of the reflow profiles for primary ovens and reflow equipment for board level assembly while co-developing many of these devices.

Expert served in positions of Technical Operations Manager, Tag Design & Development, Director of Operations, and VP and General Manager of Motorola Indala, and later of Indala. Indala was a pioneer in RFID and mainly focused on producing tag and reader products for the industrial market (asset tracking, warehousing, inventory, etc.) and access control market (employee badges, parking passes, etc.). Expert developed the world's first 100% dye sublimatible employee badge at ISO specification thickness of 0.76mm. Expert implemented OTP tags to Indala and built production/order fulfillment systems for tag programming, testing, and marking for customers. As Director of Operations, Expert also led the Smart Label tag development team in material, interconnect, process, and equipment matters which enabled high-speed production of RFID labels with silicon die attached to paper substrates.
As General Manager of Indala, Expert further demonstrated his total grasp of RFID business operations by leading the group to 26% EBIT to revenues.

Expert was manager of Motorola's Smart Card Division card and packaging development program and later as Director of Operations for 3.5 years. During that time, Expert developed interconnect and card designs to enable "combi-cards" having both RF and contact interfaces. He forged relationships with suppliers for production of inlays and IC packages. Later, Expert created a new smart card factory in Scottsdale, AZ for Motorola which included card milling, programming, personalization, test, and laser marking with a capacity of 17M cards/year. Concurrently, Expert was also a lead member of the team that set up a joint venture in Beijing, China to produce smart cards. He is very familiar with smart card applications and security schemas, and implemented processes and equipment for 3DES and PKA cards.

Expert's work in surface mount assembly at Motorola was instrumental in enabling a revolution that gave consumer electronics the ability to go portable. Expert is familiar with all facets of SMA including substrates, PCB, PCBA, solders, adhesives, designs, metal systems, solder masks, component designs, placement equipment, ICT, functional testing, reflow processes, and reliability.

Expert consulted for Earthlink, Inc. involving cost reduction, CEM sourcing strategies and negotiations in China, and new product feature definition for a desktop, home Internet appliance.He consulted for Smartrac USA involving development and delivery of a desktop RF reader/writer and interface GUI for contactless smart cards. Expert prepared for an expert witness in a patent infringement case with the Hutton & Williams law firm in the 11th District Court in Ft. Lauderdale, Florida in March 2003. The case involved the novel features and construction of a credit card.His experience with the Advanced Manufacturing Technology group of Motorola in Plantation, Florida involved trips to Motorola's major worldwide development and manufacturing sites to teach and train top level people on the use of ball grid array (BGA) soldering, placement, and verification technology. Expert was sought after by many groups including Compaq Computer in 1991 for the introduction of ASIC BGAs to replace tab processed devices. Expert has consulted with several firms developing or implementing RFID technology in the UHF and microwave spectrum, including R&D strategy, IP, product design, and organizational re-structuring.