Expert Details
Thermal Management, Electronic Packaging, Mechanical Engineering
ID: 725829
Illinois, USA
Worked on experimental and numerical simulation of flow boiling to evaluate alternative Freon/non-ozone depleting coolants. Data used to upgrade design of nuclear fuel purification facility in PaducahApplied jet impingement using gear lubricant off jet engine to cool coax-VSCF generator power conditioner. Allowed doubling of power within same envelopeDesigned an integrated spray based canister cooler with pump, nozzle, heat sink and condenserVibration sensing for seismic analysis and testing under GR-63 Core and GR-487 Core. Also, high dissipation damper concepts for seismic isolationReduction of operating costs through direct air dual-loop 2-phase cooling module and elimination of air conditioning
Education
| Year | Degree | Subject | Institution |
|---|---|---|---|
| Year: 1987 | Degree: PhD | Subject: Mechanical Engineering | Institution: University of Kentucky |
| Year: 1983 | Degree: MSME | Subject: Mechanical Engineering | Institution: University of Kentucky |
| Year: 1980 | Degree: BSME | Subject: Mechanical Engineering | Institution: Indian Institute of Technology |
Work History
| Years | Employer | Title | Department |
|---|---|---|---|
| Years: 1996 to Present | Employer: Undisclosed | Title: Director | Department: Mobile Devices |
Responsibilities:In this role he is driving the identification and implementation of reach-out technologies with emphasis on structural, thermal, acoustic, vibration, and materials. In addition he is responsible for driving mechanical simulation to enable virtual prototyping, developing and disseminating a simulation process, and enabling key technology components to meet product/customer needs. |
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| Years | Employer | Title | Department |
| Years: 1989 to 1996 | Employer: Cudo Technologies | Title: President | Department: |
Responsibilities:Founded consulting firm, employed about 11 engineers. Worked on projects in thermal management, HVAC, automation and process control, structural analysis |
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| Years | Employer | Title | Department |
| Years: 1987 to 1996 | Employer: University of Kentucky | Title: Research Associate | Department: Mechanical Engineering |
Responsibilities:Academics and research in electronic packaging, thermal management |
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Career Accomplishments
| Associations / Societies |
|---|
| ASME: American Society of Mechanical Engineers ASHRAE: American Society of Heating, Refrigeration, and Air-Conditioning Engineers IWPC: International Wireless Industry Consortium |
| Licenses / Certifications |
|---|
| Professional Engineer License, KY # 18339, IL # 062-055586 |
| Publications and Patents Summary |
|---|
| Journal publications 19 Conference papers 46 Technical reports 22 Technical reports Employer Internal 30 Engineering Awards 2 Patents/pending 11/7 R&D Contracts 24 Bravos 6 |
Fields of Expertise
fluid dynamics, fluid mechanics, electronic packaging, mechanical engineering, thermal management, cryogenic heat transfer, air moisture, air conditioning compressor, electronic equipment heat transfer, thermal sensor, electronic equipment thermal design, electronic equipment heat conduction, temperature sensor, air-conditioning equipment, internal fluid mechanics, air conditioning, Bernoulli equation, thermostat, thermodynamics, Bernoulli theorem, air flow, air conditioner