Expert Details
Semiconductor Assembly and General Technology Management
ID: 727044
New York, USA
He has been responsible for all plastic package reliability at Intel and has been the assembly manager at four companies, Intel, Xicor, EDI and ASI before going onto senior management positions in those companies.
He is responsible for introducing novel integration processes that have and continue to generate revenues in excess of $4M.
Expert has a great deal of experience in Asia where his assembly and test facilities were located. He has negotiated several advantageous business initiatives that have saved millions of dollars and improved quality and shortened lead times significantly.
He has been involved with almost every aspect of packaging technology from Al corrosion to lead finish issues. It also included an extensive background in package thermal issues and exotic materials, i.e. diamond substrates. He currently writes the Assembly/Test section for IC Knowledge and has worked with a Big Consulting Company on Package Technology.
In addition, Expert has spent the last 20 years working with Military supplying Hi Rel devices. He has spoken at several Marcus Evans events, concerning packaging technology to solve obsolescence issues and chaired the Military AeroSpace Summit in Florida last year.
Education
| Year | Degree | Subject | Institution |
|---|---|---|---|
| Year: 1974 | Degree: MS Chemistry | Subject: Electrochemistry | Institution: Clarkson University |
Work History
| Years | Employer | Title | Department |
|---|---|---|---|
| Years: 2006 to 2009 | Employer: Austin Semiconductor Inc. | Title: President | Department: |
Responsibilities:He was responsible for modernizing the entire operation which was focused on military supply with grow into the high end industrial market. |
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| Years | Employer | Title | Department |
| Years: 2004 to 2006 | Employer: Austin Semiconductor Inc. | Title: VP of Operations | Department: |
Responsibilities:Directed all manufacturing activities, including production control, purchasing, in-house custom assembly and subcons in Asia. Managed staff of 10 Engineers and 30 DLs, reporting to the President. Improved productivity by 20% lowered costs by 15% and gained back customer confidence at three major accounts. Implemented new plastic modules for military market. |
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| Years | Employer | Title | Department |
| Years: 2002 to 2003 | Employer: Peak International | Title: Eastern Regional Sales Manager | Department: |
Responsibilities:Directed sales activities east of the Mississippi from Canada to Florida. Provided technical support across all geographies. Developed new sales accounts for innovative products and grew revenue by 10% in a down market. |
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| Years | Employer | Title | Department |
| Years: 2000 to 2002 | Employer: OSEI | Title: Sales Manager | Department: |
Responsibilities:Directed sales of component assembly and test services across the entire Eastern seaboard. Provided technical support to the East Coast office in all areas of assembly and test technology. |
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Fields of Expertise
aerospace electronics science, assembly engineering, assembly sequence planning, assembly technology, corrosion engineering, diamond-like carbon coating material, electronic packaging, electronic packaging industry, electronic packaging technology, electronics manufacturing management, electronics radiation hardening, electronics research-and-development management, engineering change control, engineering project management, first level packaging, integrated-circuit package, ionic contamination, metal-insulator semiconductor device, particle filtration, plastic encapsulated microcircuit reliability, plastic semiconductor device package, printed circuit board assembly process, printed circuit board design, printed circuit board design-for-manufacturability, printed circuit board machine project management, printed circuit board manufacturing, production management, semiconductor assembly engineering, semiconductor defect analysis, semiconductor device analysis, semiconductor device failure, semiconductor device package reliability, semiconductor device package sealing, semiconductor device packaging material, semiconductor device packaging process, semiconductor product quality assurance, semiconductor product quality control, semiconductor product quality management, semiconductor quality improvement, technology management, semiconductor microhardness testing, semiconductor factory design, class of plant quality, project execution planning, ceramic engineering, self-directed work team, supplier quality engineering, semiconductor industry chemical, microelectronic chemical, photochemical etching, part feeder, electronic system design, project assessment, hydrogen absorption, discrete semiconductor device, semiconductor device testing, semiconductor device package, life-cycle cost, photoresist stripping, decontamination equipment, semiconductor process gas, device physics, silicon-on-insulator, Microsoft Project Manager, gas etching, semiconductor device electrostatic discharge protection, solvent tank, ion migration, semiconductor etching, silicon processing, silicon chip, semiconductor wafer processing, deionized water, assembly line, majority charge carrier, semiconductor technology, porous metal gas filter, semiconductor device reliability, electronic tagging system, electronic interconnect system, semiconductor material manufacturing, electronic equipment, electronics engineering, semiconductor manufacturing military specification, semiconductor device manufacturing, research and development management, engineering management, semiconductor chip, engineering, transistor, semiconductor material, semiconductor material property, semiconductor doping, semiconductor diode, project scheduling, project planning, semiconductor growth, aerospace engineering