Expert Details
Magnetron Cathode Design, Magnetic Field Modeling, PVD, Sputtering, Ion Beam Etch, Vacuum Technology
ID: 728316
California, USA
He wrote narrative sections and framework for a DOE grant proposal that resulted in a grant award for the client of $4 million.He developed concepts and compiled existing work into an "omnibus" provisional patent application for a complex capital equipment system under development by a client.He analyzed a reactive sputtering system and helped to pinpoint areas for potential improvement, resulting in solutions to client's customer issues.He analyzed and developed a set of designed experiments to optimize an ion beam process. He stabilized and brought fab maintenance issues under control by helping the maintenance people write standard work instructions.He refined and summarized the narrative for a trade secrets litigation, responses to interrogatories, developed deposition questions, and provided general assistance in the management of technical details.
Education
| Year | Degree | Subject | Institution |
|---|---|---|---|
| Year: 1989 | Degree: Master of Science | Subject: Physics | Institution: Utah State University |
| Year: 1986 | Degree: BS | Subject: Physics | Institution: University of California, Santa Barbara |
Work History
| Years | Employer | Title | Department |
|---|---|---|---|
| Years: 2005 to Present | Employer: Undisclosed | Title: Managing Member | Department: |
Responsibilities:He is primary consultant on all deposition, vacuum science, and material science issues. |
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| Years | Employer | Title | Department |
| Years: 2004 to 2005 | Employer: Tegal Corporation | Title: VP, General Manager | Department: PVD Products Group |
Responsibilities:Overall responsibility for two sputtering system product lines. |
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| Years | Employer | Title | Department |
| Years: 1999 to 2004 | Employer: First Derivative Systems, Inc. | Title: President/CEO | Department: |
Responsibilities:Founder and overall manager of a startup PVD company that built and demonstrated a 300-mm PVD system. |
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| Years | Employer | Title | Department |
| Years: 1989 to 1999 | Employer: Sputtered Films, Inc. | Title: VP, Engineering | Department: |
Responsibilities:Overall development of sputtering processes and systems. |
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Government Experience
| Years | Agency | Role | Description |
|---|---|---|---|
| Years: 1987 to 1989 | Agency: DOE - LANL | Role: Lab/Grad Fellow | Description: Research into binary and ternary alloy systems at the Center For material Science, under Ricardo Schwarz, at Los Alamos National Lab. Q clearance. |
International Experience
| Years | Country / Region | Summary |
|---|---|---|
| Years: 1994 to 2004 | Country / Region: Europe | Summary: Frequent travel in support of sales efforts, and to provide customers with technical assistance. |
| Years: 1997 to 2005 | Country / Region: Asia | Summary: Frequent travel in support of sales efforts, and to provide customers with technical assistance. |
Additional Experience
| Expert Witness Experience |
|---|
| He was expert agent in a trade secrets lawsuit that led to a settlement in favor of his client, the plaintiff. He reviewed technical files, developed questions to be used in deposition, attended depositions, advised on demands and responses for materials, etc. This assignment lasted 10 months, and ended on the evening of jury selection, when the defendant offered $19M to settle. |
| Marketing Experience |
|---|
| Expert is a veteran of the semiconductor capital equipment industry, knows many of the key suppliers, customers, and competitors. |
| Other Relevant Experience |
|---|
| Expert has done patent research and written patent specifications and grant proposals for his clients. |
Fields of Expertise
DC sputtering, deposition technology, ion sputtering, magnetron, magnetron sputtering, physical vapor deposition, radio-frequency sputtering, sputter deposition, thin-film deposition, argon sputtering, aluminum sputtering, cathode, deposition, reactive sputtering, copper sputtering, diode sputtering, magnetron theory, gold sputtering, ion-beam etching, ion etching, planarization, sputtering target, semiconductor metallizing, planar magnetron, thin-film process development, titanium nitride, tungsten sputtering, titanium sputtering, vacuum deposition, coating, compound semiconductor material, film, metal film, semiconductor wafer processing, silicon nitride, thin film, thin-film coating process, thin-film conductor, titanium nitride film, titanium nitride physical vapor deposition, titanium nitride thin film, vacuum system design, vacuum leak testing, vacuum leak detection, high-vacuum technology, high vacuum, hydride vapor phase epitaxy, multi-level metal interconnect, vacuum environment, deposition analysis, thin-film electromigration, chemical vapor deposition reactor, vacuum outgassing, plasma deposition system, silver sputtering, zirconium sputtering, chromium sputtering, molybdenum sputtering, indium tin oxide sputtering, iridium sputtering, advanced material technology, titanium getter, vacuum baking, synthetic crystal, semiconductor wafer epitaxial deposition, vacuum gage, direct current, plasma etching technology, semiconductor technology, zirconium nitride physical vapor deposition, zirconium nitride, low-energy ion beam thin-film deposition, safe semiconductor material manufacturing, deposited material, getter material, semiconductor material processing, vacuum measurement, wear-resistant coating material, ionization, thin-film analysis, thin-film circuit element, technology, vapor-phase epitaxy, vapor deposition, vacuum technology, vacuum pump, vacuum-compatible material, ultra-high vacuum, semiconductor material property, refractory, physics, metal organic chemical vapor deposition, interconnection technology, epitaxy, crystal growth, chromium, argon, aluminum