Request Expert

Experience and knowledge runs the gamut of these technologies: from epitaxial wafers; to die fabrication and testing; to micro-electronic packaging (including photo-conversion), modular integration and assembly (includes photo-initiation, photo-catalyzation and other system level knowledge). In-depth materials, process and various design elements, including non-imaging optics (NIO lenses, reflectors, sheet and films), thermal management (conduction and convection including MEMS techniques) and system level design criteria, are understood and practiced. Die, device, component, module and system-level testing, qualification and certification, methods and processes are known and accomplished. Experience in these technologies is global and in applications extends from niche to high-volume mass-production products. In addition, knowledgeable sourcing of materials, components, manufacturing contract initiation, program management and extensive understanding of IP, business development and financing, on a global basis, are also inclusive.