Years: 2008 to 2010 |
Employer: Archers Systems |
Title: Senior Advisor / CTO |
Department: |
Responsibilities:
He participates in this company's start-up business plan and fund-raising activities. He also consults for the Research and Development department to develop thin-film (a-Si and uc-Si) photo-voltaic (PV) processes, and PECVD system design for solar material (a-Si and uc-Si) deposition. |
Years: 1998 to 2007 |
Employer: UMC, Hsinchu, Taiwan/Sunnyvale, CA |
Title: Corporate Advisor and Consultant |
Department: Corporate |
Responsibilities:
He consulted with R&D to develop 45nm CMOS processes for Logic ICs, consulted Corporate Manufacturing to develop High Voltage (12-600V) 0.13u-0.6u CDMOS and BCD processes for power and power management (analog) ICs, and consulted with corporate marketing and sales departments regarding market penetration in North America and Taiwan for power and power management ICs. |
Years: 1995 to 1998 |
Employer: HMC, Hsinchu, Taiwan |
Title: President & Consultant to China Development Corp. |
Department: |
Responsibilities:
He directly managed the company's 5" Fab operation, technology development, testing, product development, R&QA and Administration groups. During his tenure, he successfully restructured and redirected the company into varied business units. |
Years: 1990 to 1995 |
Employer: VLSI Technology, Inc. |
Title: Director of Advanced Technology |
Department: |
Responsibilities:
He was responsible for managing advanced technology, product/design support and the San Antonio technology department. He was also responsible for DPDM 0.8u m CMOS development for mixed-signal products and 0.6u m/08u m anti-fuse (a-Si) CMOS process development for EPGA. |
Years: 1988 to 1990 |
Employer: MOSEL |
Title: VP of Engineering and Technology |
Department: |
Responsibilities:
He was responsible for managing technology development, SRAM design, specialty memory design and Operation departments. He also participated in foundry/business strategic alliance assessment/negotiation, and was responsible for technology/product licensing/transfer including Sharp, AKM and Fuji Electric in Japan, Hyundai in Korea, TSMC, UMC, Winbond and HMC in Taiwan and SGS-Thompson/Mostek in the U.S. |
Years: 1985 to 1988 |
Employer: Saratoga Semiconductor Corporation |
Title: VP of Technology Development and Fab Operation |
Department: |
Responsibilities:
He was responsible for managing the engineering team to bring up existing equipment, purchasing and installing new equipment in Trilogy semiconductor Fab. He also directly managed process sustaining, equipment maintenance and production in semiconductor Fap operation. Product line consisted mainly of high-performance ECL and TTL SRAM. |
Years: 1982 to 1985 |
Employer: Amdahl Corporation |
Title: Manager, Semiconductor Operation |
Department: |
Responsibilities:
Managing the technology integration, process development, pilot production, equipment maintenance and mask making departments of semiconductor operations. Development of Bipolar-CMOS process using extended electrode, self-alignment, and semi-recessed oxide isolation for a high-performance SRAM. Development of high performance bipolar process using self-alignment, fully recessed oxides isolation, and poly emitters. Process improvement and yield enhancement of 400 ECL gate array logic chips for Amdahl Current and next generation computers. |
Years: 1980 to 1982 |
Employer: Trilogy Systems |
Title: Founding Engineer/Manager, Front-End Process Technology |
Department: |
Responsibilities:
Responsible for staffing and managing the front-end process technology development department, assessment and selection of semiconductor device/process technology for Trilogy wafer-scale integration. Provided consultation on layout and equipment selection for Trilogy pilot Fab in Cupertino. |