Request Expert

LIFE PREDICTION METHODOLOGIES FOR COMPONENTS OF STRUCTURES, MACHINES, AND ELECTRONIC DEVICES. Expert's work centers on life prediction methodologies for components of structures, machines, and electronic devices. The major parameters of interest are stress, strain, time, temperature, and damage. These quantities are applied in numerous areas, such as flaw detection, quality control, proof testing, damage retardation, accelerated testing, notch problems, crack propagation, creep-fatigue interaction, fracture control, residual stress analysis, failure analysis, optimum design, aging structures, and novel methods of testing solid materials (such as thermal mapping and thermographic stress analysis (TSA) by infrared means). He is also a founder and board member of a small high-tech company at the Employer Research Park.

AMERICAN SOCIETY FOR THE TESTING OF MATERIALS (ASTM); FATIGUE STANDARDS DEVELOPMENT. Expert has been a member of the ASTM since the 1960s. He was a member of the Executive Committee of E9 on Fatigue. Expert has led the Task Group on Fatigue Education. He has intimate knowledge of fatigue standards development and integration of research results in engineering practice.

ACCELERATED TESTING. Expert has used accelerated testing in a variety of areas.

SPATE AND DELTA THERM INFRARED STRESS ANALYZERS; NONDESTRUCTIVE EVALUATION (NDE); THERMOELASTICITY. Expert has conducted research using infrared stress analyzers since 1985 with funding from the Air Force, Shell, John Deere, Ford, Pratt & Whitney, and others. In addition to the SPATE infrared stress analyzer, Expert has used the related vibration pattern imager. He has also used forced-diffusion thermography, a new thermal NDE method developed at the Employer. His work has included the areas of monolithic and composite materials, stress analysis, flaw detection, material failure analysis, mechanical behavior modeling, mechanical fatigue, creep-fatigue damage mechanics, mechanical properties, mechanical strain, mechanical stress, metal failure and analysis, nondestructive evaluation, thermoelastic stress analysis, and high-resolution full-field AC/DC thermometry.

SOLDER BEHAVIOR. Expert has conducted extensive research of solder behaviors and life prediction since 1985. He has been director of the Consortium for Mesomechanics of Electrical Interconnects (industries). Funding for his work has come from Intel, IBM, Boeing, Delco, Rockwell, and others. He has taught this subject and covered it in book chapters and technical papers. This has included the areas of creep-fatigue, electronic device reliability and testing, thermo-mechanical service environments, and surface-mount technology.

PRODUCT LIABILITY. Expert has been lecturer and/or organizer of many short courses on fatigue, fracture mechanics, failure analysis, and product liability for ASM, SAE, and SEM. He has been an expert witness on product liability in several court cases.