Expert Details
Acoustics, Audio, Noise Control, MEMS, MIxed Signal Semiconductors and Sensors
ID: 732140
Texas, USA
Semiconductor industry experience including automotive, sensors, infotainment and braking systems.
MSE in ECE with major area of Electromagnetics and Acoustics.
Member Acoustical Society of America and Institute of Noise Control Engineers.
Electrical and Acoustical Engineer with solid experience in design, test and validation of automotive, industrial and consumer software and hardware products. Demonstrated skill in product development as well as leading international teams to solve problems.
TECHNICAL SKILLS
Computer Languages: VHDL, Verilog, Python, Allegro/Orcad, Matlab, Labview, C++/C, Assembly, Arta.
Database and Data Analysis: SQL, Minitab, Datapower, Access.
Lab Equipment: logic analyzers, RF signal generators, spectrum analyzers, distortion analyzers, oscilloscopes, anechoic chamber, reverberation room, rotating boom, head and torso simulator, microphones, sound level meters and calibrators, audio telephony test setups
SOC and Microcontrollers: PIC, ARM, Freescale/Motorola, Intel.
IC Testers: Advantest/Verigy/Agilent Pinscale, 93K, Teradyne Catalyst, Credence SC212, 3500
Education
| Year | Degree | Subject | Institution |
|---|---|---|---|
| Year: 2001 | Degree: MSE | Subject: Electrical and Computer Engineering - Electromagnetics and Acoustics | Institution: University of Texas at Austin |
| Year: 2000 | Degree: Bachelor of Science | Subject: Electrical Engineering | Institution: The University of Notre Dame |
Work History
| Years | Employer | Title | Department |
|---|---|---|---|
| Years: 2016 to Present | Employer: Undisclosed | Title: Technical Support | Department: |
Responsibilities:Technical Support for lighting, video and audio systems for stage and live performances including component level debug• Multi-phase motor control • Networked video • Networked lighting |
|||
| Years | Employer | Title | Department |
| Years: 2013 to 2014 | Employer: Motion Computing | Title: Development Engineer | Department: |
Responsibilities:New product introduction, validation and manufacturing of rugged tablet computers for industrial, healthcare and safety applications with 3G/4G-LTE, GPS, WIFI, Bluetooth, RFID and bar code readers using Intel chipsets. Resolve customer issues with global sales team and customers. Organize and lead weekly conference calls with Asian ODM. Provide level 3 technical support for F5 family tablet computers.• SME for acoustics, noise control and camera product development. • Create and run system tests of power and temperature to predict new product performance to IP54 and C1D2 • Complete root cause failure analysis, document and create knowledge base (KB) articles as appropriate • Represent CE and Sustaining Engineering in Snapworks software project team including scrum. • Create and develop specification for next generation camera system with front and rear camera, LED system with flash and illuminator modes • Own and resolve issues with F5 family computers on global Customer Experience (CE) team including Windows custom image issues. • Test, qualify and release to production new touchscreen display, SSD and battery. |
|||
| Years | Employer | Title | Department |
| Years: 2012 to Present | Employer: Undisclosed | Title: Engineer and Project Manager | Department: |
Responsibilities:Engineer and project manager for acoustics, noise control, audio/video systems, and embedded control projects.• Design and implement wireless and wired audio/visual systems. • Develop test plans, methods and specifications for audio/video systems. • Consultant for Acoustics and Noise Control. • Mix live sound for recording and sound reinforcement • Technical support for ARM embedded control products with 802.11 and 802.15 wireless, temperature, humidity and proximity sensors and line powered internal battery charging. |
|||
| Years | Employer | Title | Department |
| Years: 2010 to 2012 | Employer: Seismic Instruments | Title: Development Engineer | Department: |
Responsibilities:New product development, validation and manufacturing setup of ZigBee and GPS wireless and Ethernet cable based 24 bit data acquisition systems for seismic measurements using geophones for velocity measurement and accelerometers.• Planned, developed and implemented MRP/ERP system • Development of SMPS, line interface and data acquisition system • Enhanced module and board level test using BIST and functional tests • Created prototype systems for customer evaluations and field tests • Improved first pass yield at board level test with improved hardware probes and software revisions • Revised PCBs, subcontractor module assembly and test flows to improve product cost and yield at system test • Resolved customer issues with system level test and debug before delivery to customers • Planned and implemented GPS retransmission system |
|||
| Years | Employer | Title | Department |
| Years: 2005 to 2009 | Employer: Freescale Semiconductor | Title: Staff Engineer, Multimedia Applications Division | Department: |
Responsibilities:Completed product introductions including validation of SOC, RF and digital audio ASIC devices. Formed and led teams in Europe, America and Asia to resolve customer problems. Product management on automotive ASIC devices included regular interface with customer design and quality groups in Europe.• SME for Zero Defect (ZD) automotive quality project and Y-probe sample testing. • Improved wafer sort yields by 10% and quality level to 8ppm on a 4M units per year Digital Car Radio IC with mask set revisions and SPC statistical techniques including 6 Sigma, ANOVA, PAT, GDBC and SBL. • Transfer device testing to offshore site including good unit and reject correlation, Cp, Cpk and GR&R studies. • Validated, qualified and released to production in China first production 65nm ARM1176 SOC device iMX37 including cross functional team work on video DAC, USB PHY, secure Efuses and low power modes. • Reduced iMX37 product test time by 50% with revised Verigy Pinscale test programs. • Characterized iMX37 device and developed specification for higher speed operation. • Updated burn in software and ran extended reliability testing to verify iMX37 extended operating conditions. • Debugged, qualified and released to production in China 2.7GHz Radar PLL ASIC including PPAP and 8D. • Reduced wafer sort cost by 80% on laser measurement ASIC by implementing sample (Y) probe. • Improved PLL ASIC wafer sort yield by 15% with revised Teradyne RF test hardware and programs. • Worked with failure analysis group to find root cause for NPI devices and ZD production returns. |
|||
Career Accomplishments
| Associations / Societies |
|---|
| Professional Affiliations: Member, Acoustical Society of America ASA, Institute of Noise Control Engineering INCE Reviewer for Journal of the Acoustical Society of America (JASA) |
| Professional Appointments |
|---|
| Southwest DFT Conference, Austin, Texas, 2018 Ultrasonics, Engineering Vibration, The University of Texas at Austin, Austin, Texas, 2016 Project Management Training, Consulting Solutions, Austin, TX |
Additional Experience
| Other Relevant Experience |
|---|
| Previous Experience: Design Engineer, MOTOROLA Automotive and Industrial • Board level design and development of entertainment and 2-way radios. • Designed voice path circuitry for telecom and radio including electrodynamic, piezo and electret transducers. • Developed switching power supply for line powered telecommunication. • Implemented an automated telephony testing system using Bruel & Kjaer equipment. • Evaluated radio frequency noise susceptibility of telephone desk sets. • Tested radio receivers for FCC compliance ACTIVITIES / INTERESTS Amplifier Projects • High output impedance amplifier to decrease loudspeaker distortion and voice coil heating. • Class A / Class D amplifier for low distortion at low levels with high efficiency at high levels Loudspeaker Projects • Build speaker systems with horn loaded aluminum, titanium, beryllium diaphragm compression drivers, ring radiators, electrostatic panels and piezo driven cones for mid and high frequencies. Mid and low frequencies reproduced with paper cone drivers using neodymium, ceramic and alnico magnets. |