Expert Details
Electronic Materials Science; Semiconductor & Microelectronics Materials Characterization; Hermeticity & Failure Analysis; Contamination Control
ID: 735249
Florida, USA
Expert built an extensive industrial career in the semiconductor manufacturing sector, progressing from process engineer to senior scientist and laboratory manager at organizations producing radiation-hardened and high-reliability integrated circuits for military, aerospace, government, and commercial markets, including a 25-year tenure managing analytical service laboratories. Expert subsequently transitioned into an extensive Employer consulting practice, advising more than 100 clients in the microelectronic component and medical device industries on materials composition, manufacturing processes, contamination control, troubleshooting, and failure analysis, in addition to serving in principal, associate, and quality management consulting roles for specialized firms serving these industries, including management of quality control for a company commercializing gas-getter technology for microelectronic, medical device, and nuclear applications.
Over the course of this career, Expert has authored five book chapters and 19 technical papers and conference presentations on electronic materials science and packaging topics, and holds 19 issued U.S. patents related to semiconductor processing, wafer bonding, and integrated circuit failure analysis techniques. Expert has also contributed extensively to the field through professional society involvement, including program and organizing committee service for major international reliability physics, failure analysis, and military/space electronics conferences, and has served as an instructor and tour speaker for professional societies in the microelectronics and chemistry fields.
Education
| Year | Degree | Subject | Institution |
|---|---|---|---|
| Year: 1969 | Degree: MS | Subject: Inorganic Chemistry | Institution: Florida Atlantic University |
| Year: 1966 | Degree: BS | Subject: Chemistry | Institution: Stetson University |
Work History
| Years | Employer | Title | Department |
|---|---|---|---|
| Years: 2001 to Present | Employer: Undisclosed | Title: Consultant | Department: |
Responsibilities:Advised more than 100 clients in the microelectronic component and medical device industries on materials composition, manufacturing usage, impurity and contamination control, troubleshooting, compositional analysis, and failure analysis of materials used in microelectronic component manufacturing.• TJ Green Associates, LLC — Advised clients on electronic package hermeticity, moisture and contamination control, and device failure analysis. • Arthur Jonath Associates — Worked with a team of consultants guiding clients in the microelectronic device, medical device, and related industries on problem solving, root cause analysis, product and business development, and customer service enhancement. • Vacuum Energy, Inc. — Managed manufacturing and product quality control/improvement efforts for a company (emerging from National Laboratory status) commercializing macro-film gas getters (particularly for hydrogen) in sealed enclosures for the microelectronic device, medical device, and nuclear industries. • Oneida Research Services — Materials Analyst (affiliated consultant) |
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| Years | Employer | Title | Department |
| Years: 1998 to 2001 | Employer: Intersil Corporation | Title: Senior Scientist and Manager of Analytical Service Laboratories | Department: |
Responsibilities:A manufacturer of integrated circuits for military, aerospace applications, and wireless integrated circuits for commercial applications. |
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| Years | Employer | Title | Department |
| Years: 1972 to 1998 | Employer: Harris Semiconductor | Title: Senior Scientist and Manager of Analytical Service Laboratories | Department: |
Responsibilities:Manufacturer of high-reliability digital and analog integrated circuits for military, aerospace, government, and commercial applications. Established and oversaw company analytical laboratory; provided materials analysis support to incoming inspection, product manufacturing, product reliability and failure analysis investigations. |
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| Years | Employer | Title | Department |
| Years: 1969 to 1972 | Employer: Radiation, Inc. | Title: Process Engineer | Department: |
Responsibilities:Developed advanced lithography and device packaging materials for semiconductor manufacturing. |
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Additional Experience
| Expert Witness Experience |
|---|
| Expert has served as an expert witness or subject matter expert in five matters. Engagements have included: chemical analysis of paint overspray on employee vehicles for an employer, supporting an insurance claim recovery; a patent infringement dispute; compressed gas analysis; failure to identify electronic components as counterfeit goods, engaged by law firms in both a subject matter expert and testifying expert witness capacity; and an intellectual property dispute involving gas getter technology, engaged by a law firm as subject matter expert. These engagements draw directly on Expert's core technical background in materials characterization, contamination analysis, gas analysis, and semiconductor/electronic component composition and authentication. |
Career Accomplishments
| Associations / Societies |
|---|
| • American Chemical Society — Tour Speaker, presenting "The Chemistry of Microelectronics" across nine ACS local-section tour itineraries in the U.S. • International Reliability Physics Symposium — Program Committee Member, 3 years • International Symposium for Testing and Failure Analysis — Program Committee Member, 4 years • Components for Military and Space Electronics Exhibition — Organizing Committee Member, 5 years • Minnowbrook Microelectronics Conference — Organizing Committee Member, 7 years • International Microelectronics and Packaging Society — Professional Development Course Instructor, 3 years |
| Publications and Patents Summary |
|---|
| • 5 book chapters, covering topics including residual gas analysis and failure modes in hermetic electronic packages, Auger electron spectroscopy for integrated circuit failure analysis, semiconductor material specifications, electronic processes and environment, and silicon lifetime degradation from wet chemical cleaning • 19 selected technical papers and conference presentations (1978–2018), covering topics including hermetic package moisture control and testing, residual gas analysis, silicon die cracking resistance, plastic delamination in IC packaging, volatile gas analysis in hermetic MEMS and microcircuit enclosures, surface property characterization, counterfeit electronic components, and hydrogen effects on components • 19 issued U.S. patents (including 2 reissue patents), covering technologies including moisture content measurement in hermetic semiconductor devices, silicon etching methods, bonded wafer processing (including metal silicidation and oxidative bonding variants), radiation-hardened EEPROM dielectrics, and laser decapsulation methods/apparatus for integrated circuit packages |
Fields of Expertise
electronic material, hermetic packaging, material analysis, supplier quality assurance, failure analysis, component design, quality control, Electronic Materials Science, Semiconductor Materials, Microelectronics, Residual Gas Analysis (RGA), Integrated Circuit Packaging, Decapsulation, Moisture Control, Materials Characterization, Bonded Wafer Processing, Radiation-Hardened Electronics, Medical Device Materials, Counterfeit Component Detection, root cause analysis, hermeticity testing, contamination control, Auger electron spectroscopy