Expert Details

Semiconductor Industry IC Package Design and Development, Consulting and Training

ID: 723560 California, USA

Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers

Expert has Ph.D. in analyzing interconnection technologies, including High-speed packaging, circuit simulation, HF simulation, electromagnetic simulation, crosstalk.

Expert has over 20 years of experience in design, development and analysis of IC packaging, including multichip modules, system in packages, leadless chip carriers, leadframe packages

Expert has over 20 years of experience in design, development and analyzing of electronic packages particularly multichip modules/system in packages, ball grid arrays, land grid arrays

Expert has been involved in all steps of packaging and PCB substrate development including defining design rules, design guidelines and material selection for substrates, PTH vias, printed board assembly, laminate or ceramic materials, design for manufacturability

Request Expert

Education

Year	Degree	Subject	Institution
Year: 1992	Degree: PhD	Subject: Electrical Engineering	Institution: Technical University of Berlin
Year: 1986	Degree: MSEE	Subject: Electrical Engineering	Institution: Technical University of Berlin

Work History

Years	Employer	Title	Department
Years: 2006 to Present	Employer: Undisclosed	Title: Independent Consultant	Department:
Responsibilities: ·Independent Consulting in IC Packaging design and development, Electrical Analysis ·Material selection for Packaging Materials, including Substrates, Die Adhesives, Encapsulation, Interconnection ·Vendor sourcing and interaction for product development
Years	Employer	Title	Department
Years: 2004 to 2006	Employer: Meggitt Electronics Endevco	Title: Project Engineering Manager	Department: Systems Engineering
Responsibilities: ·She managed the development team including packaging, materials, electrical, mechanical, and software engineers ·She coordinated and led product development within Stage Gate Process, troubleshooting, and testing of new systems for smart sensors, MEMs, MOEMs using Six Sigma/DOE principles ·Ensured proper transition of new products to Integration and Manufacturing Engineering
Years	Employer	Title	Department
Years: 1999 to 2004	Employer: Conexant Systems Inc.	Title: Principal Packaging Engineer	Department: IC Packaging and Assembly
Responsibilities: ·Managed several projects with cross-functional teams from IC design to package manufacturing, test and reliability to achieve cost reduction on wafer and package level and improve the technology. ·Developed design guidelines and product package roadmaps, aligning business needs with technical advancements ·Assessed emerging technologies (Flip Chip, stacked die, scribe line reduction). ·Developed new packages introducing new product design rules for the company’s next generation of RF-IC products (e.g. world’s smallest Power Amplifiers, LNAs, and Bluetooth). Worked closely with substrate and assembly manufacturers and cross-functional teams ·Performed electrical analysis of IC packages in Simultaneous switching noise, IBIS modeling, and parasitic analysis ·Reviewed package layouts for all advanced packages from Leadframe, RF-LGA and Multichip Modules to high I/O Ball Grid Array. ·Consulted different divisions for package selection, product design and design analysis prior to and post layout, input on cost, material and technology, gave workshops on Advance Packaging technologies
Years	Employer	Title	Department
Years: 1995 to 1999	Employer: FRAUNHOFER INSTITUTE IN BERLIN – GERMANY	Title: Head of Department	Department: Multichip Modules
Responsibilities: Managed a group of 19 scientists/engineers. Led projects within Package Design, RF modeling and simulation, EMC/EMI analysis, HF measurement and test, and software development. Coordinated the priorities, schedules and budgets for the Research and Engineering. Worked in research and development of advanced IC packages. ·Used Ansoft HFSS, Q3D/Q2D, PSPICE/HSPICE. ·Authored numerous chapters in the books: Direct Attachment of ICs (German, Editor Prof. Reichl) and EMC Cookbook for PCBs (German).
Years	Employer	Title	Department
Years: 1987 to 1994	Employer: Technical University of Berlin	Title: Research Associate	Department: Microperipherik
Responsibilities: Worked towards PH.D in Package Electrical Analysis, wrote a software program to support package design and SI analysis.

International Experience

Years	Country / Region	Summary
Years: 1987 to 1999	Country / Region: Berlin/Germany	Summary: Expert worked in different positions at the Technical University and at the Fraunhofer Institute for packaging research and development

Additional Experience

Training / Seminars
·She organized and presented several seminars on Signal Integrity, MCM and Advanced Package Technologies

Vendor Selection
She has experience in locating package substrate manufacturers, package assembly vendors

Language Skills

Language	Proficiency
German	She speaks fluent in German
Turkish	She speaks fluent Turkish

Fields of Expertise

Request Expert

Expert Details

Semiconductor Industry IC Package Design and Development, Consulting and Training

Education

Work History

Responsibilities:

Responsibilities:

Responsibilities:

Responsibilities:

Responsibilities:

International Experience

Additional Experience

Language Skills

Fields of Expertise